Process for producing sputtering target and sputtering target
US-2018315586-A1 · Nov 1, 2018 · US
Manufacturing of targets
Manufacturing of targets · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01J37/3491 |
| Official title | {Manufacturing of targets} |
| Display label | Manufacturing of targets |
| Total patents | 243 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 24 |
| 2017 | 17 |
| 2018 | 31 |
| 2019 | 27 |
| 2020 | 36 |
| 2021 | 27 |
| 2022 | 19 |
| 2023 | 18 |
| 2024 | 12 |
| 2025 | 14 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Process for producing sputtering target and sputtering target
US-2018304400-A1 · Oct 25, 2018 · US
Cylindrical sputtering target, cylindrical compact, manufacturing method of cylindrical sputtering target, and manufacturing method of cylindrical sintered compact
US-9834839-B2 · Dec 5, 2017 · US
Cathode Assembly
US-2017283941-A1 · Oct 5, 2017 · US
Sputtering target with backside cooling grooves
US-9779920-B2 · Oct 3, 2017 · US
Target Assembly
US-2017268097-A1 · Sep 21, 2017 · US
Indium sputtering target and method for manufacturing same
US-9758860-B2 · Sep 12, 2017 · US
Sputtering device component with modified surface and method of making
US-2017229295-A1 · Aug 10, 2017 · US
Copper alloy sputtering target and manufacturing method of copper alloy sputtering target
US-2017213711-A1 · Jul 27, 2017 · US
Backing plate-integrated metal sputtering target and method of producing same
US-9711336-B2 · Jul 18, 2017 · US
In-Cu Alloy Sputtering Target And Method For Producing The Same
US-2017169998-A1 · Jun 15, 2017 · US
Silver-alloy based sputtering target
US-2017166999-A1 · Jun 15, 2017 · US
Target material for sputtering and method for manufacturing same
US-2017130328-A1 · May 11, 2017 · US
Sputtering Target Comprising Ni-P Alloy or Ni-Pt-P Alloy and Production Method Therefor
US-2017121811-A1 · May 4, 2017 · US
Oxide sputtering target, and thin film transistor using the same
US-2017092773-A1 · Mar 30, 2017 · US
Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device
US-2017069474-A1 · Mar 9, 2017 · US
Plating stack to condition a bonding surface
US-9556511-B2 · Jan 31, 2017 · US
Method of manufacturing sputtering target and sputtering target
US-2017009336-A1 · Jan 12, 2017 · US
Oxide sputtering target, and thin film transistor using the same
US-9543444-B2 · Jan 10, 2017 · US
Off-axis sputtering deposition for growth of single crystalline films of a broad range of complex materials
US-2016362812-A1 · Dec 15, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01J37/3491?
- CPC H01J37/3491 is the Cooperative Patent Classification code for “Manufacturing of targets.”
- How many patents are filed under CPC H01J37/3491 (Manufacturing of targets)?
- Our database includes 243 publications tagged with this CPC code.
- Is patent activity under CPC H01J37/3491 growing?
- Publication counts under this code: 12 in 2024 vs 14 in 2025 (latest complete years).