Superalloy target
US-11866805-B2 · Jan 9, 2024 · US
Cylindrical sputtering target, cylindrical compact, manufacturing method of cylindrical sputtering target, and manufacturing method of cylindrical sintered compact
US9834839B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9834839-B2 |
| Application number | US-201615082035-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 28, 2016 |
| Priority date | Mar 27, 2015 |
| Publication date | Dec 5, 2017 |
| Grant date | Dec 5, 2017 |
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- Title
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Abstract
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A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a difference therebetween in the relative density of 0.1% or smaller.
First claim
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What is claimed is: 1. A cylindrical sputtering target, comprising: a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween, the plurality of cylindrical sintered compacts containing ITO or IGZO and having a relative density of 99.7% or higher and 99.9% or lower, and the plurality of cylindrical sintered compacts adjacent to each other having a difference therebetween in the relative density of 0.1% or smaller, wherein the relative densities of the plurality of cylindrical sintered compacts are different from each other.
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Products characterised by their shape · CPC title
Surface properties, e.g. surface roughness · CPC title
Density · CPC title
at an oxygen percentage above that of air · CPC title
based on oxide ceramics · CPC title
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- What does patent US9834839B2 cover?
- A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a difference therebetween in the relative density of 0.1% or smaller.
- Who is the assignee on this patent?
- Jx Nippon Mining & Metals Corp
- What technology area does this patent fall under?
- Primary CPC classification C23C14/3414. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).