Chip resistor and method for manufacturing the same
US-10453593-B2 · Oct 22, 2019 · US
adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52)
adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01C17/02 |
| Official title | adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) |
| Display label | adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) |
| Total patents | 161 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 13 |
| 2017 | 14 |
| 2018 | 20 |
| 2019 | 17 |
| 2020 | 11 |
| 2021 | 18 |
| 2022 | 14 |
| 2023 | 11 |
| 2024 | 18 |
| 2025 | 12 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resistor with upper surface heat dissipation
US-10438729-B2 · Oct 8, 2019 · US
Wire-wound resistor and method for manufacturing same
US-10256014-B2 · Apr 9, 2019 · US
Chip resistor and method for manufacturing same
US-10134510-B2 · Nov 20, 2018 · US
Transparent pane with an electrical heating layer, and production process therefor
US-10124770-B2 · Nov 13, 2018 · US
Resistor and method for manufacturing resistor
US-10121574-B2 · Nov 6, 2018 · US
Epoxy-based resin system composition containing a latent functionality for polymer adhesion improvement to prevent sulfur related corrosion
US-10121573-B2 · Nov 6, 2018 · US
Chip resistor element
US-10104776-B2 · Oct 16, 2018 · US
Chip Resistor and Method for Producing Chip Resistor
US-2018277286-A1 · Sep 27, 2018 · US
Ceramic heater and manufacturing method thereof
US-10082293-B2 · Sep 25, 2018 · US
Chip resistor and method for manufacturing the same
US-2018261361-A1 · Sep 13, 2018 · US
Electrode for carbon fiber plate heating element and method for producing the same
US-10057943-B2 · Aug 21, 2018 · US
Atomizer for an aerosol delivery device and related input, aerosol production assembly, cartridge, and method
US-2018168233-A1 · Jun 21, 2018 · US
Chip resistor and method for manufacturing the same
US-9997281-B2 · Jun 12, 2018 · US
Heatable luminaire cover
US-9994195-B2 · Jun 12, 2018 · US
Ceramic electronic component and manufacturing method therefor
US-9997293-B2 · Jun 12, 2018 · US
Method to join nano technology carbon allotrope heaters
US-2018160481-A1 · Jun 7, 2018 · US
Chip Resistor
US-2018158578-A1 · Jun 7, 2018 · US
Resistor and method of manufacture
US-9934891-B1 · Apr 3, 2018 · US
Atomizer for an aerosol delivery device and related input, aerosol production assembly, cartridge, and method
US-9918495-B2 · Mar 20, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01C17/02?
- CPC H01C17/02 is the Cooperative Patent Classification code for “adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52).”
- How many patents are filed under CPC H01C17/02 (adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52))?
- Our database includes 161 publications tagged with this CPC code.
- Is patent activity under CPC H01C17/02 growing?
- Publication counts under this code: 18 in 2024 vs 12 in 2025 (latest complete years).