Chip resistor and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10453593-B2
Application number	US-201815977143-A
Country	US
Kind code	B2
Filing date	May 11, 2018
Priority date	Feb 19, 2015
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

First claim

The invention claimed is:

1. A chip resistor comprising:
a substrate including a first surface, a second surface, and a side surface, the first surface and the second surface facing in opposite directions to each other, the first surface including a first end part and a second end part that are spaced apart from each other in plan view, the side surface being located between the first surface and the second surface;
two upper electrodes respectively located on the first end part of the first surface and the second end part of the first surface;
a resistor element located on the first surface of the substrate, the resistor element including a part that is located between the two upper electrodes in plan view;
a first insulating layer covering the two upper electrodes and the resistor element;
a second insulating layer covering the two upper electrodes and the first insulating layer;
a side electrode electrically connected to one of the two upper electrodes, the side electrode including a first portion and a second portion, the first portion of the side electrode being located on the side surface of the substrate, the second portion of the side electrode overlapping the first surface of the substrate and the second surface of the substrate in plan view;
an intermediate electrode covering the side electrode; and
an external electrode covering the intermediate electrode,
wherein the two upper electrodes include a first upper electrode and a second upper electrode, and the first upper electrode includes a first portion that is located between the substrate and the resistor element, and
wherein the first upper electrode includes a second portion that does not overlap the resistor element in plan view and that has a constant thickness, and the first portion of the first upper electrode is smaller in thickness than the second portion of the first upper electrode.

2. The chip resistor according to claim 1 , wherein the first portion of the first upper electrode is located between the first surface of the substrate and the resistor element.

3. The chip resistor according to claim 2 , wherein the first portion of the first upper electrode overlaps the resistor element in plan view.

4. The chip resistor according to claim 1 , wherein one of the two upper electrodes contacts the side electrode, the first insulating layer, the second insulating layer, and the resistor element.

5. The chip resistor according to claim 1 , wherein the side electrode contacts the second insulating layer.

6. The chip resistor according to claim 1 , wherein the intermediate electrode covers an end of the side electrode.

7. The chip resistor according to claim 1 , wherein the intermediate electrode contacts the second insulating layer.

8. The chip resistor according to claim 1 , wherein the external electrode contacts the second insulating layer.

9. The chip resistor according to claim 1 , wherein the resistor element includes a first side surface that faces the side electrode side, and
the first insulating layer contacts the first side surface of the resistor element.

10. The chip resistor according to claim 1 , further comprising a rear electrode located on the second surface of the substrate, the side electrode being electrically connected to the rear electrode.

11. The chip resistor according to claim 10 , wherein the intermediate electrode overlaps the rear electrode in plan view, and contacts the rear electrode.

12. The chip resistor according to claim 1 , wherein the resistor element includes a part that does not overlap the first insulating layer.

13. The chip resistor according to claim 10 , wherein the first insulating layer overlaps the rear electrode in plan view.

14. The chip resistor according to claim 1 , wherein each of the first insulating layer and the second insulating layer directly contacts the second portion of the first upper electrode.

15. The chip resistor according to claim 1 , wherein the first portion of the side electrode directly contacts the side surface of the substrate, and the side electrode extends onto an upper surface of the second insulating layer.

Assignees

• Rohm Co Ltd

Inventors

• Shinoura Takanori
• Imahashi Wataru

Classifications

• H01C17/006

  adapted for manufacturing resistor chips · CPC title

• H01C17/288

  by thin film techniques · CPC title

• H01C17/02

  adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · CPC title

• H01C17/28

  adapted for applying terminals · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title