Chip resistor and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9997281-B2
Application number	US-201615044671-A
Country	US
Kind code	B2
Filing date	Feb 16, 2016
Priority date	Feb 19, 2015
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

First claim

The invention claimed is:

1. A chip resistor comprising:
a substrate having a first surface, a second surface and a side surface, the first and the second surfaces being spaced apart from each other in a thickness direction of the substrate, the side surface being located between the first surface and the second surface;
an upper electrode provided on the first surface of the substrate;
a resistor element arranged on the first surface of the substrate and electrically connected to the upper electrode;
a side electrode electrically connected to the upper electrode and has a first, a second and a third portion, the first portion being arranged on the side surface of the substrate, the second portion and the third portion overlapping with the first surface and the second surface in the thickness direction, respectively;
an intermediate electrode covering the side electrode;
an external electrode covering the intermediate electrode;
a first protective layer located between the upper electrode and the intermediate electrode, the first protective layer being in contact with the upper electrode and the side electrode and being more resistant to sulfurization than the upper electrode; and
an electroconductive second protective layer located between the first protective layer and the intermediate electrode, the second protective layer being in contact with the first protective layer, the side electrode and the intermediate electrode,
wherein the upper electrode includes a first portion that overlaps with the resistor element in a plan view and that is located between the first surface and the resistor element, and
the upper electrode includes a second portion that overlaps with the side electrode in the plan view and that is located between the first surface and the side electrode.

2. The chip resistor according to claim 1 , wherein the first protective layer contains carbon particles.

3. The chip resistor according to claim 1 , wherein the first protective layer is an electrical insulator.

4. The chip resistor according to claim 1 , wherein the second protective layer contains Ag.

5. The chip resistor according to claim 1 , wherein the side electrode is made of Ni—Cr alloy.

6. The chip resistor according to claim 1 further comprising a rear electrode provided on the second surface of the substrate, wherein the side electrode is electrically connected to the rear electrode.

7. The chip resistor according to claim 6 , wherein the rear electrode is covered with the intermediate electrode.

8. The chip resistor according to claim 6 , wherein the rear electrode includes a lower surface that is in contact with the intermediate electrode and the side electrode.

9. The chip resistor according to claim 1 , wherein the substrate is an electrical insulator.

10. The chip resistor according to claim 9 , wherein the substrate is made of alumina.

11. The chip resistor according to claim 1 , wherein the resistor element has a serpentine shape.

12. The chip resistor according to claim 1 , wherein the resistor element includes at least one of RuO 2 or Ag—Pd alloy.

13. The chip resistor according to claim 1 , wherein the resistor element is provided with a trimming groove.

14. The chip resistor according to claim 1 , wherein the intermediate electrode and the external electrode are each made of a plating layer.

15. The chip resistor according to claim 14 , wherein the intermediate electrode is a Ni plating layer.

16. The chip resistor according to claim 14 , wherein the external electrode is made of a Sn plating layer.

17. The chip resistor according to claim 1 further comprising a protective film covering the resistor element and a part of the upper electrode.

18. The chip resistor according to claim 17 , wherein a part of the first protective layer is covered with the protective film.

19. The chip resistor according to claim 17 , wherein the protective film includes a lower protective film and an upper protective film.

20. The chip resistor according to claim 19 , wherein the lower protective film contains glass.

21. The chip resistor according to claim 19 , wherein the upper protective film contains epoxy resin.

22. The chip resistor according to claim 19 , wherein the upper protective film includes: a first thickness in a first area in which the upper protective film is in contact with the external electrode; and a second thickness in a second area different from the first area, the second thickness being larger than the first thickness.

23. The chip resistor according to claim 19 , wherein the resistor element includes a part that does not overlap with the lower protective film.

24. The chip resistor according to claim 1 , wherein the second protective layer includes an upper surface that is in contact with the intermediate electrode and the side electrode.

25. A method for manufacturing a chip resistor comprising the steps of:
forming an upper electrode on an obverse surface of a sheet-like substrate;
forming, on the obverse surface of the sheet-like substrate, a resistor element electrically connected to the upper electrode, wherein the upper electrode includes a first portion that overlaps with the resistor element in a plan view and that is located between the obverse surface and the resistor element;
forming, on an upper surface of the upper electrode, a first protective layer that is more resistant to sulfurization than the upper electrode;
forming, on an upper surface of the first protective layer, an electroconductive second protective layer;
dividing the sheet-like substrate into a plurality of elongated substrates each having a side surface, a first surface, and a second surface, the side surface extending in a longitudinal direction of the elongated substrate, and the first surface and the second surface being located opposite to each other;
forming, on the side surface, the first surface and the second surface of each of the elongated substrates, a side electrode electrically connected to the upper electrode and in contact with the first protective layer and the second protective layer,
wherein the upper electrode includes a second portion that overlaps with the side electrode in the plan view and that is located between the first surface and the side electrode; and
forming an intermediate electrode covering the side electrode and the second protective layer, and an external electrode covering the intermediate electrode.

26. The method according to claim 25 , wherein the first protective layer is formed a process involving printing.

27. The method according to claim 25 , wherein the second protective layer is formed by a process involving printing.

28. The method according to claim 25 , wherein the side electrode is formed by physical vapor deposition.

29. The method according to claim 28 , wherein the physical vapor deposition is a sputtering method.

30. The method according to claim 25 , wherein the resistor element is formed by a process involving printing or a process involving physical vapor deposition and photolithography.

31. The method according to claim 25 , further comprising the step of dividing each of the elongated substrates into a plurality of pieces, before the step of forming the intermediate electrode and the external electrode.

32. The method accordi

Assignees

• Rohm Co Ltd

Inventors

• Shinoura Takanori
• Imahashi Wataru

Classifications

• H01C17/242

  by laser · CPC title

• H01C17/288

  by thin film techniques · CPC title

• H01C1/142 Primary

  the terminals or tapping points being coated on the resistive element · CPC title

• H01C17/02

  adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title