Ceramic electronic component and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9997293-B2
Application number	US-201514805525-A
Country	US
Kind code	B2
Filing date	Jul 22, 2015
Priority date	Jan 29, 2013
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.

First claim

What is claimed is:

1. A ceramic electronic component comprising:
a ceramic main body;
a coating film on a surface of the ceramic main body; and
an electrode adjacent the surface of the ceramic main body,
wherein the coating film comprises a resin, and a constituent element of the ceramic main body, and the constituent element of the ceramic main body is an element that was eluted from the ceramic main body.

2. The ceramic electronic component according to claim 1 , wherein the constituent element of the ceramic main body comprises at least one of Ba, Ti, Ca, Zr, Fe, Ni, Cu, Zn, Mn, Co, Al and Si.

3. The ceramic electronic component according to claim 1 , wherein the resin has a thermal decomposition temperature of 240° C. or higher.

4. The ceramic electronic component according to claim 1 , wherein the resin comprises at least one of an epoxy resin, a polyimide resin, a silicone resin, a polyamideimide resin, a PEEK resin, and a fluorine-containing resin.

5. The ceramic electronic component according to claim 1 , wherein the coating film contains cross-linked resin components.

6. The ceramic electronic component according to claim 1 , further comprising a plated film on the electrode.

7. The ceramic electronic component according to claim 1 , wherein the electrode is on a surface of the coating film.

8. A ceramic electronic component comprising:
a ceramic main body;
a coating film on a surface of the ceramic main body; and
an electrode adjacent the surface of the ceramic main body,
wherein the coating film is formed on the surface of the ceramic main body by providing, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize a constituent element of the ceramic main body, and
the coating film comprises a resin and a constituent element of the ceramic main body, the constituent element being ionized and deposited from the ceramic main body.

Assignees

• Murata Manufacturing Co

Inventors

• Inoue Mitsunori
• Mori Tomohiko

Classifications

• H01F2027/2809

  on stacked layers · CPC title

• H01C17/00

  Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01F27/23

  Corrosion protection · CPC title

• H01C7/102

  Varistor boundary, e.g. surface layers (H01C7/12 takes precedence) · CPC title