Resistor with upper surface heat dissipation

Patent metadata

Field	Value
Publication number	US-10438729-B2
Application number	US-201816181006-A
Country	US
Kind code	B2
Filing date	Nov 5, 2018
Priority date	Nov 10, 2017
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.

First claim

What is claimed is:

1. A resistor comprising:
a resistive element having an upper surface, a bottom surface, a first side, and an opposite second side; and
a first heat dissipation element adjacent the first side of the resistive element and a second heat dissipation element adjacent the second side of the resistive element, wherein a gap is provided between the first heat dissipation element and the second heat dissipation element, wherein each heat dissipation element has an inner portion having a first height, and an outer portion, at least a portion of the outer portion having a second height less than the first height of the inner portion;
an adhesive material bonding and thermally coupling both the outer portions and the inner portions of the first heat dissipation element and the second heat dissipation element to the upper surface of the resistive element;
a first electrode layer positioned along the bottom surface of the resistive element, adjacent the first side of the resistive element;
a second electrode layer positioned along the bottom surface of the resistive element, adjacent the second side of the resistive element;
a dielectric material covering upper surfaces of the first heat dissipation element and the second heat dissipation element and filling the gap between the first heat dissipation element and the second heat dissipation element; and,
a dielectric material deposited on the bottom surface of at least the resistive element and portions of bottom surfaces of the first and second electrode layers.

2. The resistor of claim 1 , further comprising:
a first solderable layer covering a first side of the resistor, the first solderable layer in contact with the first heat dissipation element, the resistive element, and the first electrode layer; and,
a second solderable layer covering a second side of the resistor, the second solderable layer in contact with the second heat dissipation element, the resistive element, and the second electrode layer.

3. The resistor of claim 2 , wherein the first solderable layer covers at least a portion of the upper surface of the first heat dissipation element, and at least a portion of a bottom surface of the first electrode layer.

4. The resistor of claim 3 , wherein the second solderable layer covers at least a portion of the upper surface of the second heat dissipation element, and at least a portion of a bottom surface of the second electrode layer.

5. The resistor of claim 1 , wherein the adhesive is positioned only between the first and second heat dissipation elements and the resistive element.

6. The resistor of claim 1 , wherein at least portions of the first heat dissipation element and the second heat dissipation element each have a swage at an upper and an outer corners of each of the heat dissipation elements.

7. The resistor of claim 6 , wherein the swages form a step in at least portions of each of the heat dissipation elements.

8. The resistor of claim 1 , wherein the first heat dissipation element and the second heat dissipation element each have portions that are stepped, angled or rounded.

9. The resistor of claim 1 , wherein the resistive element comprises copper-nickel-manganese (CuNiMn), copper-manganese-tin (CuMnSn), copper-nickel (CuNi), nickel-chromium-aluminum (NiCrAl), or nickel-chromium (NiCr).

10. The resistor of claim 1 , wherein the resistive element has a thickness of about 0.001″ to about 0.015″.

11. A method of manufacturing a resistor, the method comprising:
laminating a conductor to a resistive element using an adhesive;
masking and patterning the conductor to divide the conductor into a plurality of heat dissipation elements;
forming each heat dissipation element into an inner portion having a first height, and an outer portion, at least a portion of the outer portion having a second height less than the first height;
plating electrode layers on a bottom surface of the resistive element;
depositing a dielectric material on the bottom surface of the resistive element between and at least partially covering the electrode layers; and,
depositing a dielectric material on at least portions of the plurality of heat dissipation elements to electrically isolate the plurality of heat dissipation elements from each other.

12. The method of claim 11 , further comprising the steps of:
plating a first solderable layer to a first side of the resistor, the first solderable layer in contact with a heat dissipation element, the resistive element, and an electrode layer; and,
plating a second solderable layer to a second side of the resistor, the second solderable layer in contact with a heat dissipation element, the resistive element, and an electrode layer.

13. The method of claim 12 , wherein the first solderable layer covers at least a portion of the upper surface of a heat dissipation element, and at least a portion of a bottom surface of an electrode layer.

14. The method of claim 13 , wherein the second solderable layer covers at least a portion of the upper surface of a heat dissipation element, and at least a portion of a bottom surface of an electrode layer.

15. The method of claim 11 , wherein the adhesive is positioned only between the first and second heat dissipation elements and the resistive element.

16. The method of claim 11 , wherein at least portions of the heat dissipation elements each have a swage at upper and outer corners of the heat dissipation elements.

17. The method of claim 16 , wherein the swages form a step in at least portions of each of the heat dissipation elements.

18. The method of claim 11 , wherein the heat dissipation elements each have portions that are stepped, angled or rounded.

19. The method of claim 11 , wherein the resistive element has a thickness of about 0.001″ to about 0.015″.

20. A resistor comprising:
a resistive element;
first and second heat dissipation elements that are electrically insulated from one another by a dielectric material and are coupled to a top surface of the resistive element via an adhesive, each heat dissipation having a swage in at least portions of upper and outer corners of the heat dissipation elements, the swage providing for a first portion of each heat dissipation element having a first height, and a second portion of each heat dissipation element having a second height, the second height being less than the first height, the adhesive having portions positioned between the first portion and second portion of each heat dissipation element and the top surface of the resistor and coupling the first portion and second portion of each heat dissipation element to the top surface of the resistor;
a first electrode layer disposed on a bottom surface of the resistive element;
a second electrode layer disposed on a bottom surface of the resistive element; and,
first and second solderable layers extending respectively along at least a portion of a bottom of the resistor including the first electrode layer and the second electrode layer, along at least a portion of a first outer side and at least a portion of a second outer side of the resistor, and along at least a portion of a top surface of the resistor;
wherein the first and second portions of each heat dissipation elements are thermally coupled to the resistive element via the adhesive material and solderable layers.

Assignees

• Vishay Dale Electronics Llc

Inventors

• Wyatt Todd L
• Glenn Darin W

Classifications

• H01C1/01

  Mounting; Supporting · CPC title

• H01C17/28

  adapted for applying terminals · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C1/034

  the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence) · CPC title

• H01C17/02

  adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · CPC title