Devices and methods to measure small displacements
US-2020378752-A1 · Dec 3, 2020 · US
by investigating thermal coefficient of expansion
by investigating thermal coefficient of expansion · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G01N25/16 |
| Official title | by investigating thermal coefficient of expansion |
| Display label | by investigating thermal coefficient of expansion |
| Total patents | 110 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 5 |
| 2017 | 12 |
| 2018 | 13 |
| 2019 | 9 |
| 2020 | 10 |
| 2021 | 12 |
| 2022 | 5 |
| 2023 | 14 |
| 2024 | 12 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Measuring thermal expansion and the thermal crown of rolls
US-10799926-B2 · Oct 13, 2020 · US
Evaluation method for thermal expansion properties of titania-containing silica glass body, and manufacturing method for titania-containing silica glass body
US-2020319124-A1 · Oct 8, 2020 · US
Method for determining real-time thermal deformation attitude of spindle
US-2020311321-A1 · Oct 1, 2020 · US
Method for estimating characteristics of ceramic fired body
US-2020300745-A1 · Sep 24, 2020 · US
Test device and method to determine low temperature thermal cracking of composite materials
US-2020249219-A1 · Aug 6, 2020 · US
Deformation measuring apparatus and method of evaluating deformation using thereof
US-10712299-B2 · Jul 14, 2020 · US
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
US-10699972-B2 · Jun 30, 2020 · US
Coefficient-of-thermal-expansion measurement method and measuring device for coefficient of thermal expansion
US-10627204-B2 · Apr 21, 2020 · US
Residual thermal strain measurement method, residual thermal strain measurement device, and program therefor
US-2020056880-A1 · Feb 20, 2020 · US
Apparatus and method for the determination of the absolute coefficient of thermal expansion in ultralow expansion materials
US-10458936-B2 · Oct 29, 2019 · US
Coefficient-of-thermal-expansion measurement method of dimension reference gauge, measuring device for coefficient of thermal expansion and reference gauge
US-10352678-B2 · Jul 16, 2019 · US
Methods and systems using optical fiber interferometry
US-2019212212-A1 · Jul 11, 2019 · US
Strain detecting device and diagnosing device
US-2019195817-A1 · Jun 27, 2019 · US
Method for estimating stress of electronic component
US-10317296-B2 · Jun 11, 2019 · US
Thermal deformation amount calculation device, three-dimensional lamination system, three-dimensional lamination method, and program
US-2019143607-A1 · May 16, 2019 · US
Methods and systems using optical fiber interferometry
US-10281341-B2 · May 7, 2019 · US
Measuring device for coefficient of thermal expansion and measurement method for coefficient of thermal expansion
US-2019064089-A1 · Feb 28, 2019 · US
Measuring device for coefficient of thermal expansion and measurement method for coefficient of thermal expansion
US-2019064090-A1 · Feb 28, 2019 · US
Measuring total organic carbon of shales using thermal expansion
US-10101494-B2 · Oct 16, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC G01N25/16?
- CPC G01N25/16 is the Cooperative Patent Classification code for “by investigating thermal coefficient of expansion.”
- How many patents are filed under CPC G01N25/16 (by investigating thermal coefficient of expansion)?
- Our database includes 110 publications tagged with this CPC code.
- Is patent activity under CPC G01N25/16 growing?
- Publication counts under this code: 12 in 2024 vs 6 in 2025 (latest complete years).