Deformation measuring apparatus and method of evaluating deformation using thereof

Patent metadata

Field	Value
Publication number	US-10712299-B2
Application number	US-201715483776-A
Country	US
Kind code	B2
Filing date	Apr 10, 2017
Priority date	Nov 8, 2016
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (Δh) of the specimen.

First claim

What is claimed is:

1. A deformation measuring apparatus comprising:
a holder which supports a specimen;
a contact portion disposed facing the holder and comprising a hemispherical tip;
a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen;
a heating chamber which surrounds the holder and the contact portion, wherein a temperature of inside of the heating chamber is controlled to heat the specimen to expand; and
a sensing portion which measures force applied on the tip of the contact portion by the expanded specimen when heated,
wherein the sensing portion measures the force applied on the tip of the contact portion while a position of the tip of the contact portion relative to the holder is fixed during the heating of the specimen.

2. The deformation measuring apparatus of claim 1 , wherein the position controlling portion comprises:
a linear transporting portion connected to the contact portion, wherein the linear transporting portion linearly moves along a thickness direction of the specimen in the heating chamber, and
an operation controller which controls an operation of transporting the linear transporting portion or fixes the linear transporting portion in a predetermined position.

3. The deformation measuring apparatus of claim 2 , wherein the heating chamber comprises:
a body surrounding the holder and the contact portion;
a door mounted in a side of the body to allow the specimen to be disposed inside the body; and
a through-hole defined in an upper part of the body, wherein the linear transporting portion linearly moves in the heating chamber through the through-hole.

4. The deformation measuring apparatus of claim 1 , wherein the sensing portion is electrically connected to the contact portion or the position controlling portion.

5. A method of evaluating a thickness direction deformation of the specimen using the deformation measuring apparatus of claim 1 , the method comprising:
disposing the specimen on the holder to face the contact portion;
adjusting a position of the contact portion along the thickness direction of the specimen so that the hemispherical tip of the contact portion is in contact with the surface of the specimen;
measuring the thermal deformation force (F) of the specimen, or the thickness direction thermal expansion ( 4 h ) of the specimen while heating the specimen; and
evaluating the thickness direction deformation of the specimen using the measured thermal deformation force of the specimen, or the measured thickness direction thermal expansion of the specimen.

6. The method of claim 5 , further comprising:
fixing the position of the disposed contact portion when the contact portion is in contact with the surface of the specimen.

7. The method of claim 5 , wherein the specimen is heated by increasing an inner temperature of the heating chamber.

8. The method of claim 5 , wherein the evaluating the thickness direction deformation of the specimen comprises:
calculating a length (L 1 ) of a portion of the surface of the heated specimen, which is in contact with the hemispherical tip using the measured thickness direction thermal expansion (Δh) of the specimen, based on a cross-sectional surface cut along the thickness direction of the specimen; and
comparing the calculated length of the portion of the surface of the heated specimen in contact with the hemispherical tip to a length (L 0 ) of a corresponding portion of the surface of the specimen before being heated, to calculate a thermal deformation (ΔL=L 1 -L 0 ) of the specimen.

9. The method of claim 8 , wherein the thermal deformation (ΔL) of the specimen satisfies the following equation:

Δ
⁢

⁢
L

=

π
⁢

⁢
r
×

θ
180

-

r
⁢

⁢
sin
⁢

⁢
θ

r
⁢

⁢
sin
⁢

⁢
θ

×
100

,

wherein

θ
=

cos

-
1

(

1
-

Δ
⁢

⁢
h

r

)

,

and
r denotes a radius of curvature of the hemispherical tip.

10. The method of claim 5 , wherein the evaluating the thickness direction deformation of the specimen comprises:
calculating a thermal stress (σ) of the specimen using a contact area (S) and the measured thermal deformation force (F) of the heated specimen,
wherein the contact area (S) is defined as an area covered with the hemispherical tip in a plane among an uppermost surface of the specimen.

11. The method of claim 10 , wherein the thermal stress (a) satisfies the following equation:

σ
=

F

π
⁡

(

r
⁢

⁢
sin
⁢

⁢
θ

)

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Ga Hee
• Jung Young Suk
• Yang Yoo Seong
• Lee Young Hoon
• Lee Hyun Mi

Classifications

• G01N25/482 Primary

  concerning the temperature responsive elements (measuring temperature or quantity of heat, thermally-sensitive elements G01K; thermoelectric devices H10N10/00, H10N15/00) · CPC title

• G01B21/20

  for measuring contours or curvatures, e.g. determining profile · CPC title

• G01B21/085

  using thermal means · CPC title

• G01N25/16 Primary

  by investigating thermal coefficient of expansion · CPC title

• G01B5/30

  for measuring the deformation in a solid, e.g. mechanical strain gauge · CPC title