Electroplating apparatus with membrane tube shield

Patent metadata

Field	Value
Publication number	US-9469911-B2
Application number	US-201514601989-A
Country	US
Kind code	B2
Filing date	Jan 21, 2015
Priority date	Jan 21, 2015
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.

First claim

The invention claimed is:

1. Apparatus comprising:
a vessel for holding a first electrolyte;
one or more anodes in the vessel;
a substrate holder for holding a substrate in a process position in the vessel;
a membrane tube ring in the vessel vertically between the one or more anodes and the process position; and
the membrane tube ring having no electrode therein and containing a gas or a liquid having an electrical conductivity less than the first electrolyte;
wherein the membrane tube ring shields the substrate holder from an electric field in the first electrolyte created by the one or more anodes.

2. The apparatus of claim 1 comprising at least one fluid source and a valve for connecting the at least one fluid source to the membrane tube ring.

3. The apparatus of claim 1 further comprising a second membrane tube ring in the vessel concentric with and adjacent to the membrane tube ring.

4. The apparatus of claim 3 with the second membrane tube ring adjoining the membrane tube ring.

5. The apparatus of claim 1 further including a diffuser plate in the vessel, with the membrane tube ring in or on the diffuser plate.

6. The apparatus of claim 1 with the vessel having a diameter of 305 to 380 mm and with the membrane tube ring having an outside diameter of 2-6 mm.

7. The apparatus of claim 1 further including a dielectric field shaping unit in the vessel between the one or more anodes and the process position, and with the membrane tube ring vertically between the field shaping unit and the substrate.

8. The apparatus of claim 1 with the substrate holder further including a rotor for rotating the substrate.

9. Apparatus comprising:
a vessel;
a first electrolyte and at least one anode in the vessel providing an electric field in the first electrolyte;
a substrate holder including a rotor for holding a substrate in a process position in the vessel;
a membrane tube ring in the vessel above the at least one anode and below the process position;
the membrane tube ring having no electrode therein and containing a second electrolyte having an electrical conductivity less than the first electrolyte; and
a dielectric field shaping unit in the vessel below the membrane tube ring and between the at least one anode and the process position with the difference in conductivity between the first electrolyte and the second electrolyte causing the membrane tube ring to reduce the electric field at a perimeter of the process position.

10. Apparatus comprising:
a vessel holding an electrolyte;
one or more anodes in the vessel;
a substrate holder for holding a substrate in a process position above the anodes;
a membrane tube ring in the vessel between the one or more anodes and the process position,
a first fluid source containing a first fluid and a second fluid source containing a second fluid, with the first fluid having an electrical conductivity different from the second fluid and from the electrolyte;
a valve for connecting the first fluid source or the second fluid source to the membrane tube ring;
wherein the membrane tube ring has no electrode therein and shields the substrate holder from an electric field in the first electrolyte created by the one or more anodes when the membrane tube ring is supplied with the first fluid from the first fluid source.

Assignees

• Applied Materials Inc

Inventors

• Mchugh Paul R
• Wilson Gregory J
• Shaviv Roey

Classifications

• C25D5/00 Primary

  Electroplating characterised by the process; Pretreatment or after-treatment of workpieces · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D17/007

  Current directing devices · CPC title