Method of adjusting plating apparatus, and measuring apparatus

Patent metadata

Field	Value
Publication number	US-2016369422-A1
Application number	US-201615182469-A
Country	US
Kind code	A1
Filing date	Jun 14, 2016
Priority date	Jun 18, 2015
Publication date	Dec 22, 2016
Grant date	—

Abstract

There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate. The method of adjusting the plating apparatus has the steps of: installing a first jig at a position in the plating bath where the substrate holder is installed; installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed; measuring a positional relation between the first jig and the second jig installed in the plating bath using a sensor included in either of the first jig and the second jig; and adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation.

First claim

What is claimed is:

1 . A method of adjusting a plating apparatus, the method comprising the steps of:
providing a plating bath configured to be able to hold a substrate holder, an anode holder, and an electric field adjusting plate; installing a first jig at a position in the plating bath where the substrate holder is installed; installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed; measuring a positional relation between the first jig and the second jig installed in the plating bath using sensors included in either of the first jig and the second jig; and adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation.

2 . The method of adjusting the plating apparatus according to claim 1 , wherein
the sensors included in either of the first jig and the second jig include a position measuring sensor, the other of the first jig and the second jig has a position measuring member, the step of measuring the positional relation includes a step in which the position measuring sensor measures a distance from a reference position to the position measuring member in an in-plane direction of a surface of the first jig, the surface being opposed to the second jig, and wherein the step of adjusting the installation position includes a step of adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate in the in-plane direction based on the measured distance.

3 . The method of adjusting the plating apparatus according to claim 2 , wherein
the position measuring member is a position measuring pin that protrudes toward the opposing first jig or second jig, and wherein the position measuring sensor is configured to be able to numerically display a distance from a reference position to the position measuring pin in an in-surface direction of the substrate holder.

4 . The method of adjusting the plating apparatus according to claim 2 , comprising the steps of:
arranging in a desired positional relation the first jig and the second jig that have not been installed in the plating bath; and measuring the reference position of the position measuring member by the position measuring sensor in a state where the first jig and the second jig are arranged in the desired positional relation.

5 . The method of adjusting the plating apparatus according to claim 1 , wherein
the sensors included in either of the first jig and the second jig include at least three distance measuring sensors, the other of the first jig and the second jig has a distance measuring member, the step of measuring the positional relation includes a step in which the distance measuring sensor measures a distance from the distance measuring sensor to the distance measuring member, and wherein the step of adjusting the installation position includes a step of adjusting an inclination of the substrate holder, the anode holder, or the electric field adjusting plate, or a position thereof in a normal direction of the substrate holder, based on the measured distance.

6 . The method of adjusting the plating apparatus according to claim 5 , wherein
the distance measuring member is a distance measuring pin that protrudes toward the opposing first jig or second jig, and wherein the distance measuring sensor is configured to be able to numerically display a distance from the distance measuring sensor to the distance measuring pin.

7 . The method of adjusting the plating apparatus according to claim 5 , comprising the steps of:
arranging in a desired positional relation the first jig and the second jig that have not been installed in the plating bath; and measuring a distance to the distance measuring member by the distance measuring sensor in a state where the first jig and the second jig are arranged in the desired positional relation.

8 . The method of adjusting the plating apparatus according to claim 1 , wherein
the first jig and the second jig have at least two angle measuring reference positions, respectively, the step of measuring the positional relation includes a step of detecting presence/absence of a deviation of rotation angles of the angle measuring reference position formed at the first jig and the angle measuring reference position formed at the second jig, the rotation angles being around the normal direction of the substrate holder, and wherein the step of adjusting the installation position includes a step of adjusting the rotation angle of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured deviation of the rotation angles.

9 . The method of adjusting the plating apparatus according to claim 8 , wherein
the first jig and the second jig have angle measuring holes in the angle measuring reference positions, respectively, and wherein the step of measuring the positional relation includes a step of detecting the presence/absence of the deviation of the rotation angles by inserting an angle measuring pin in the angle measuring hole formed in the first jig and the angle measuring hole formed in the second jig.

10 . The method of adjusting the plating apparatus according to claim 9 , comprising the steps of:
arranging in a desired positional relation the first jig and the second jig that have not been installed in the plating bath; and aligning positions of the angle measuring hole formed in the first jig and the angle measuring hole formed in the second jig in a state where the first jig and the second jig are arranged in the desired positional relation.

11 . The method of adjusting the plating apparatus according to claim 1 , wherein
the plating apparatus has a paddle provided between the anode holder and the substrate holder, and wherein the method comprises the steps of:
measuring a positional relation between the first jig and the paddle installed in the plating bath; and
adjusting an installation position of the substrate holder or the paddle based on the measured positional relation.

12 . A measuring apparatus that measures positions in a plating bath where a substrate holder, an anode holder, and an electric field adjusting plate are arranged, the measuring apparatus comprising:
a first jig installed at a position in the plating bath where the substrate holder is installed; and a second jig installed at a position in the plating bath where the anode holder or the electric field adjusting plate is installed, wherein either of the first jig and the second jig includes sensors, and wherein the sensors are configured to measure a positional relation between the first jig and the second jig.

13 . The measuring apparatus according to claim 12 , wherein
the sensors included in either of the first jig and the second jig include a position measuring sensor, the other of the first jig and the second jig has a position measuring member, and wherein the position measuring sensor is configured to measure a distance from a reference position to the position measuring member in a surface of the first jig, the surface being opposed to the second jig.

14 . The measuring apparatus according to claim 13 , wherein
the position measuring member is a position measuring pin that protrudes toward the opposing first jig or second jig, and wherein the position measuring sensor is configured to be able to numerically display a distance from a reference position to the position measuring pin in an in-plane direction of the substrate holder.

Assignees

• Ebara Corp

Inventors

• Fujikata Jumpei
• Shimoyama Masashi
• Araki Yuji
• Nagai Mizuki

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10W70/093 Primary

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/005

  Contacting devices · CPC title

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title