Apparatus for electroplating of electrodes on photovoltaic structures

Patent metadata

Field	Value
Publication number	US-2017110622-A1
Application number	US-201615294183-A
Country	US
Kind code	A1
Filing date	Oct 14, 2016
Priority date	Oct 14, 2015
Publication date	Apr 20, 2017
Grant date	—

Abstract

A wafer-holding apparatus for electroplating of a solar cell wafer is provided. The wafer has chamfered corners and comprises a plurality of busbar areas, wherein at least one busbar area is near an edge of the wafer. The wafer-holding apparatus includes a plurality of wafer-holding mechanisms for maintaining contact with a wafer. One of the plurality of wafer-holding mechanisms can be longer than at least one other wafer-holding mechanism, thereby facilitating secure contact with the busbar area near the edge of the wafer, which is shorter than other busbar areas on the wafer due to the chamfered corners.

First claim

What is claimed is:

1 . A wafer-holding apparatus for electroplating of a solar cell wafer, which has chamfered corners and comprises a plurality of busbar areas, wherein at least one busbar area is near an edge of the wafer, the apparatus comprising:
a plurality of wafer-holding mechanisms for maintaining contact with a wafer; wherein one of the plurality of wafer-holding mechanisms is longer than at least one other wafer-holding mechanism, thereby facilitating secure contact with the busbar area near the edge of the wafer, which is shorter than other busbar areas on the wafer due to the chamfered corners.

2 . The wafer-holding apparatus of claim 1 , wherein a respective wafer-holding mechanism comprises a spring-loading portion and a contact portion.

3 . The wafer-holding apparatus of claim 2 , wherein the spring-loading portion is bent away from the wafer.

4 . The wafer-holding apparatus of claim 2 , wherein the spring-loading portion comprises at least one opening to facilitate electroplating.

5 . The wafer-holding apparatus of claim 1 , wherein a respective wafer-holding mechanism has a first portion and a second portion;
wherein the first portion is configured to be in contact with a first surface of the wafer; and wherein the second portion is configured to be in contact with a second surface of the wafer.

6 . The wafer-holding apparatus of claim 5 ,
wherein the first portion is electrically coupled to the first surface of the wafer; and wherein the second portion is electrically insulated from the second surface of the wafer.

7 . The wafer-holding apparatus of claim 1 , wherein each wafer-holding mechanism comprises a front spring loading portion and a back spring loading portion; and
wherein the front or back spring loading portion comprises a metallic or non-metallic strip or wire.

8 . The wafer-holding apparatus of claim 1 , wherein the front or back piece comprises a spring-loading portion, which comprises sheet metal.

9 . A wafer-holding apparatus for electroplating of a solar cell wafer, comprising:
a plurality of wafer-holding mechanisms for holding and maintaining contact with the wafer; wherein the wafer-holding mechanism are of substantially equal length; wherein a respective wafer-holding mechanism has a front piece and a back piece configured to be in contact with a front surface and a back surface of the wafer, respectively; and wherein the front piece of the wafer-holding mechanism is narrower than the back piece.

10 . The wafer-holding apparatus of claim 9 , wherein the front piece comprises a spring-loading portion and a contact portion.

11 . The wafer-holding apparatus of claim 10 , wherein the spring-loading portion is bent away from the wafer.

12 . The wafer-holding apparatus of claim 10 , wherein the spring-loading portion comprises at least one opening to facilitate electroplating.

13 . The wafer-holding apparatus of claim 9 , wherein the front piece is electrically coupled to the front surface of the wafer; and
wherein the back piece is electrically insulated from the back surface of the wafer.

14 . The wafer-holding apparatus of claim 9 , wherein the front or back piece comprises a spring-loading portion that is a metallic or non-metallic strip or wire.

15 . The wafer-holding apparatus of claim 9 , wherein the front or back piece comprises a spring-loading portion, which comprises sheet metal.

16 . A wafer-holding apparatus for electroplating of a solar cell wafer, comprising:
a plurality of wafer-holding mechanisms for holding and maintaining contact with the wafer, each wafer-holding mechanism having a wafer clamp; a first tab; and a second tab; wherein the first tab is connected to the clamps on a first side; wherein the second tab is connected to the clamps on a second side; and wherein the first tab and second tab are coupled by at least one spring, thereby allowing the clamps to be opened together.

17 . The wafer-holding apparatus of claim 16 , wherein each clamp comprises a first prong and a second prong.

18 . The wafer-holding apparatus of claim 17 , wherein the first prong is connected to the first tab, and second prong is connected to the second tab.

19 . The wafer-holding apparatus of claim 16 , further comprising a spring mechanism between the first tab and second tab.

20 . The wafer-holding apparatus of claim 16 , further comprising an edge stop positioned on one side of the wafer-holding mechanisms, thereby facilitating alignment of the wafer with the wafer-holding mechanisms.

Assignees

• Solarcity Corp

Inventors

• De Vries Nicholas G J
• Sun Zhi-Wen

Classifications

• H10P72/7622

  characterised by supporting substrates others than wafers, e.g. chips · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• C25D7/126

  for solar cells · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title