Coating forming device and coating forming method for forming metal coating

Patent metadata

Field	Value
Publication number	US-2016265128-A1
Application number	US-201615064226-A
Country	US
Kind code	A1
Filing date	Mar 8, 2016
Priority date	Mar 11, 2015
Publication date	Sep 15, 2016
Grant date	—

Abstract

A coating forming device for forming a metal coating on a surface of a substrate includes: an anode; a power supply; and a solid electrolyte membrane disposed between the anode and the substrate and contains metal ions. The solid electrolyte membrane includes: a contact surface that is a region contacting a coating-forming region where the metal coating is formed; and a concave portion recessed relative to the contact surface such that, when the contact surface contacts the coating-forming region, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region. The metal ions are reduced to form the metal coating on the coating-forming region by the power supply applying a voltage between the anode and the substrate.

First claim

What is claimed is:

1 . A coating forming device for forming a metal coating on a surface of a substrate, the coating forming device comprising:
an anode; a power supply that applies a voltage between the anode and the substrate; and a solid electrolyte membrane that is disposed between the anode and the substrate and contains metal ions, the solid electrolyte membrane including
a contact surface that is a region contacting a coating-forming region, the coating-forming region being a region of a surface of the substrate where the metal coating is formed, and
a concave portion that is recessed relative to the contact surface such that, when the contact surface contacts the coating-forming region, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region,
the metal ions being reduced to form the metal coating on the coating-forming region by the power supply applying a voltage between the anode and the substrate in a state where the contact surface is in contact with the substrate.

2 . The coating forming device according to claim 1 , wherein
water repellency of a surface of the concave portion is higher than water repellency of the contact surface.

3 . The coating forming device according to claim 1 , wherein
the surface of the concave portion includes an inclined surface that is inclined relative to the contact surface such that a depth of the concave portion increases from an edge portion of the contact surface toward an inside of the concave portion.

4 . The coating forming device according to claim 1 , further comprising:
a pressing unit configured to press the solid electrolyte membrane toward the substrate; a pressure measuring unit configured to measure a pressure at which the solid electrolyte membrane presses the substrate; and a controller configured to control the pressing unit such that a pressure measured by the pressure measuring unit is constant during a formation of the metal coating.

5 . A coating forming method for forming a metal coating, the coating forming method comprising:
contacting a solid electrolyte membrane toward a substrate, the solid electrolyte membrane containing metal ions and being disposed between an anode and the substrate; and forming the metal coating on a surface of the substrate by applying a voltage between the anode and the substrate to reduce the metal ions, the solid electrolyte membrane including a contact surface and a concave portion, and the concave portion being recessed relative to the contact surface such that, when the contact surface contacts a coating-forming region of the surface of the substrate where the metal coating is formed, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region.

6 . The coating forming method for forming a metal coating according to claim 5 , wherein
water repellency of a surface of the concave portion is higher than water repellency of the contact surface.

7 . The coating forming method for forming a metal coating according to claim 5 , wherein
the surface of the concave portion includes an inclined surface that is inclined relative to the contact surface such that a depth of the concave portion increases from an edge portion of the contact surface toward an inside of the concave portion, and the substrate is disposed below the solid electrolyte membrane during a formation of the metal coating.

8 . The coating forming method for forming a metal coating according to claim 5 , wherein
the substrate is pressed toward the solid electrolyte membrane during a formation of the metal coating, and a pressure at which the substrate is pressed toward the solid electrolyte membrane is controlled to be constant during the formation of the metal coating.

Assignees

• Toyota Motor Co Ltd

Inventors

• Usui Hiroki
• Yanagimoto Hiroshi
• Hiraoka Motoki
• Sato Yuki

Classifications

• C25D17/007

  Current directing devices · CPC title

• C25D5/22

  Electroplating combined with mechanical treatment during the deposition · CPC title

• C25D5/02 Primary

  Electroplating of selected surface areas · CPC title

• C25D17/14

  for pad-plating · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title