Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-2017283977-A1
Application number	US-201715458327-A
Country	US
Kind code	A1
Filing date	Mar 14, 2017
Priority date	Mar 29, 2016
Publication date	Oct 5, 2017
Grant date	—

Abstract

A substrate processing apparatus includes a holding device that includes a conductive member and holds a substrate, a conduction path structure that includes a conductive material and positioned such that the conduction path structure is in contact with the holding device, a supply device that supplies a processing liquid to the substrate held by the holding device, and a grounding structure including a variable resistance device that changes a resistance such that the grounding structure has a first end portion connected the conduction path structure and a second end portion connected to a ground potential.

First claim

1 . A substrate processing apparatus, comprising:
a holding device comprising a conductive member and configured to hold a substrate; a conduction path structure comprising a conductive material and positioned such that the conduction path structure is in contact with the holding device; a supply device configured to supply a processing liquid to the substrate held by the holding device; and a grounding structure comprising a variable resistance device configured to change a resistance such that the grounding structure has a first end portion connected the conduction path structure and a second end portion connected to a ground potential.

2 . The substrate processing apparatus of claim 1 , further comprising:
a control device comprising circuitry configured to control the variable resistance part, wherein the circuitry of the control device is configured to control the variable resistance device such that during a supply period from a time when the supply of the processing liquid to the substrate is started to a time when the supply of the processing liquid to the substrate is finished, the resistance of the variable resistance device immediately after the start of the supply period is higher than the resistance of the variable resistance device thereafter.

3 . The substrate processing apparatus of claim 2 , wherein the variable resistance device comprises a first resistor having a first resistance, a second resistor having a second resistance that is higher than the first resistance, and a switch that switches between the first resistor and the second resistor such that one of the first resistor and the second resistor is connected to the grounding structure, and the circuitry of the control device is configured to control the switch such that the switch connects the second resistor to the grounding structure immediately after the start of the supply period and thereafter connects the first resistor to the grounding structure.

4 . The substrate processing apparatus of claim 2 , wherein the variable resistance device is a variable resistor that changes a resistance according to a signal input from the circuitry of the control device.

5 . The substrate processing apparatus of claim 1 , wherein the conduction path structure is a rotation mechanism configured to rotate the holding device.

6 . The substrate processing apparatus of claim 5 , wherein the rotation mechanism comprises a conductive rotation shaft in electrical contact with the holding device and rotatably supporting the holding device, an electric motor configured to rotate the rotation shaft, a conductive container configured to store a conductive liquid, and a conductive connection member having a first end portion in electrical contact with the rotation shaft and a second end portion positioned to be immersed in the liquid, and the grounding structure has the first end portion connected to the conductive container of the rotation mechanism.

7 . The substrate processing apparatus of claim 6 , wherein the conductive connection member has a rod shape extending in a longitudinal direction and is connected coaxially with the rotation shaft such that the conductive connection member is connected to an end of the rotation shaft on an opposite side with respect to a load end of the rotation shaft.

8 . The substrate processing apparatus of claim 6 , wherein the rotation mechanism comprises an insulating bearing positioned between the electric motor and the rotation shaft such that the insulating bearing is rotatably supporting the rotation shaft.

9 . The substrate processing apparatus of claim 1 , further comprising:
a measurement device configured to measure a charge amount of the substrate; a substrate transport device configured to carry the substrate held by the holding device to the measurement device; and an estimation device configured to estimate a charge amount of the holding device based on a measurement result of the measurement device.

10 . The substrate processing apparatus of claim 9 , wherein the estimation device is configured to estimate the charge amount of the holding device based on the measurement result and a correction amount corresponding to a rising amount of the substrate from the holding device when the substrate is received from the holding device.

11 . The substrate processing apparatus of claim 7 , wherein the rotation mechanism comprises an insulating bearing positioned between the electric motor and the rotation shaft such that the insulating bearing is rotatably supporting the rotation shaft.

12 . The substrate processing apparatus of claim 2 , wherein the conduction path structure is a rotation mechanism configured to rotate the holding device.

13 . The substrate processing apparatus of claim 12 , wherein the rotation mechanism comprises a conductive rotation shaft in electrical contact with the holding device and rotatably supporting the holding device, an electric motor configured to rotate the rotation shaft, a conductive container configured to store a conductive liquid, and a conductive connection member having a first end portion in electrical contact with the rotation shaft and a second end portion positioned to be immersed in the liquid, and the grounding structure has the first end portion connected to the conductive container of the rotation mechanism.

14 . The substrate processing apparatus of claim 13 , wherein the conductive connection member has a rod shape extending in a longitudinal direction and is connected coaxially with the rotation shaft such that the conductive connection member is connected to an end of the rotation shaft on an opposite side with respect to a load end of the rotation shaft.

15 . The substrate processing apparatus of claim 13 , wherein the rotation mechanism comprises an insulating bearing positioned between the electric motor and the rotation shaft such that the insulating bearing is rotatably supporting the rotation shaft.

16 . The substrate processing apparatus of claim 2 , further comprising:
a measurement device configured to measure a charge amount of the substrate; a substrate transport device configured to carry the substrate held by the holding device to the measurement device; and an estimation device configured to estimate a charge amount of the holding device based on a measurement result of the measurement device.

17 . The substrate processing apparatus of claim 16 , wherein the estimation device is configured to estimate the charge amount of the holding device based on the measurement result and a correction amount corresponding to a rising amount of the substrate from the holding device when the substrate is received from the holding device.

18 . The substrate processing apparatus of claim 14 , wherein the rotation mechanism comprises an insulating bearing positioned between the electric motor and the rotation shaft such that the insulating bearing is rotatably supporting the rotation shaft.

19 . The substrate processing apparatus of claim 3 , wherein the conduction path structure is a rotation mechanism configured to rotate the holding device.

20 . A substrate processing method, comprising:
holding a substrate; and supplying a processing liquid to the substrate connected to a ground potential, wherein the supplying of the processing liquid includes changing a resistance between the substrate and the ground potential by a variable resistance device configured to change the resistance.

Assignees

• Tokyo Electron Ltd

Inventors

• Iino Tadashi
• Ihara Toru
• Kai Yoshihiro
• Tokunaga Yoichi

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title