Manufacturing a package using plateable encapsulant
US-2019341324-A1 · Nov 7, 2019 · US
Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1882 |
| Official title | {Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers} |
| Display label | Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers |
| Total patents | 93 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 9 |
| 2017 | 11 |
| 2018 | 15 |
| 2019 | 16 |
| 2020 | 9 |
| 2021 | 10 |
| 2022 | 3 |
| 2023 | 2 |
| 2024 | 2 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus for graphene-mediated metallization of polymer films
US-2019284712-A1 · Sep 19, 2019 · US
Plating method, plating apparatus and recording medium
US-2019267242-A1 · Aug 29, 2019 · US
Controlled growth of ultranarrow nanowires on functionalized 2d materials and uses thereof
US-2019264332-A1 · Aug 29, 2019 · US
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
US-2019264329-A1 · Aug 29, 2019 · US
Semiconductor package with plateable encapsulant and a method for manufacturing the same
US-10396007-B2 · Aug 27, 2019 · US
Plating method, plating apparatus and recording medium
US-2019256980-A1 · Aug 22, 2019 · US
Electroless plating of silver onto graphite
US-10361016-B2 · Jul 23, 2019 · US
Heat radiating plate-lined ceramics substrate
US-2019198421-A1 · Jun 27, 2019 · US
Method for forming metal wiring
US-10249531-B1 · Apr 2, 2019 · US
Method for forming metal wiring
US-2019088539-A1 · Mar 21, 2019 · US
Method of producing electroconductive substrate, electronic device and display device
US-2019043736-A1 · Feb 7, 2019 · US
Copper foil with carrier, copper foil with resin and method for manufacturing printed wiring board
US-2018376602-A1 · Dec 27, 2018 · US
Method for producing electroconductive laminate, three-dimensional structure with plated-layer precursor layer, three-dimensional structure with patterned plated layer, electroconductive laminate, touch sensor, heat generating member, and three-dimensional structure
US-2018371619-A1 · Dec 27, 2018 · US
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same
US-10138558-B2 · Nov 27, 2018 · US
Method for producing noble metal nanocomposites
US-10106895-B2 · Oct 23, 2018 · US
Method for producing noble metal nanocomposites
US-2018282872-A1 · Oct 4, 2018 · US
Coating composition, composite prepared by using the coating composition and method for preparing the same
US-10085351-B2 · Sep 25, 2018 · US
Plating catalyst and method
US-10066299-B2 · Sep 4, 2018 · US
Polymer articles, ink compositions, and methods for selectively metalizing polymer articles
US-10017859-B2 · Jul 10, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1882?
- CPC C23C18/1882 is the Cooperative Patent Classification code for “Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers.”
- How many patents are filed under CPC C23C18/1882 (Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers)?
- Our database includes 93 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1882 growing?
- Publication counts under this code: 2 in 2024 vs 3 in 2025 (latest complete years).