3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
US-2024140864-A1 · May 2, 2024 · US
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Heat
Heat · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1865 |
| Official title | {Heat} |
| Display label | Heat |
| Total patents | 18 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 2 |
| 2017 | 1 |
| 2018 | 3 |
| 2019 | 2 |
| 2020 | 3 |
| 2021 | 1 |
| 2023 | 2 |
| 2024 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
System and method for direct electroless plating of 3d-printable glass for selective surface patterning
US-2023095982-A1 · Mar 30, 2023 · US
Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer
US-11561631-B2 · Jan 24, 2023 · US
Plating method, plating apparatus and recording medium
US-11028483-B2 · Jun 8, 2021 · US
Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer
US-2020409488-A1 · Dec 31, 2020 · US
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
US-2020148593-A1 · May 14, 2020 · US
Optical printing systems and methods
US-10640873-B2 · May 5, 2020 · US
Optical printing systems and methods
US-2019264327-A1 · Aug 29, 2019 · US
Plating method, plating apparatus and recording medium
US-2019256980-A1 · Aug 22, 2019 · US
Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US-2018350670-A1 · Dec 6, 2018 · US
Adhesion promoting agents for metallization of substrate surfaces
US-9920432-B2 · Mar 20, 2018 · US
Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US-9865501-B2 · Jan 9, 2018 · US
Pre-treatment method of plating, storage medium, and plating system
US-9650717-B2 · May 16, 2017 · US
Pre-treatment method for plating and storage medium
US-9523153-B2 · Dec 20, 2016 · US
Method of metalizing surface and article obtainable
US-9512522-B2 · Dec 6, 2016 · US
Pre-treatment method of plating, storage medium, and plating system
US-2015247242-A1 · Sep 3, 2015 · US
Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment
US-9070750-B2 · Jun 30, 2015 · US
Pre-treatment method for plating and storage medium
US-2015140209-A1 · May 21, 2015 · US