Pre-treatment method for plating and storage medium

Patent metadata

Field	Value
Publication number	US-9523153-B2
Application number	US-201414548893-A
Country	US
Kind code	B2
Filing date	Nov 20, 2014
Priority date	Nov 21, 2013
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

A pre-treatment method for plating can form a plating layer having sufficient adhesivity on an inner surface of a recess and on a surface of a substrate at an outside of the recess even when the recess has a high aspect ratio. The pre-treatment method for plating includes a preparation process of preparing the substrate having the recess; a first coupling layer forming process of forming a first coupling layer 21 a at least on the inner surface of the recess of the substrate by using a first coupling agent; and a second coupling layer forming process of forming a second coupling layer 21 b at least on the surface of the substrate at the outside of the recess by using a second coupling agent after the first coupling layer forming process.

First claim

We claim:

1. A pre-treatment method for plating, the pre-treatment method comprising:
a preparing process of preparing a substrate having a recess;
a first coupling layer forming process of forming a first coupling layer at least on an inner surface of the recess of the substrate by using a first coupling agent; and
a second coupling layer forming process of forming a second coupling layer at least on a surface of the substrate at an outside of the recess by using a second coupling agent which is different from the first coupling agent after the first coupling layer forming process.

2. The pre-treatment method of claim 1 ,
wherein the first coupling agent is a silane coupling agent and the second coupling agent is a titanium coupling agent.

3. The pre-treatment method of claim 1 ,
wherein the first coupling layer forming process is performed through a vacuum deposition process and the second coupling layer forming process is performed through a liquid process.

4. The pre-treatment method of claim 3 ,
wherein the liquid process is performed by supplying the second coupling agent in a liquid state onto the substrate while rotating the substrate about a vertical axis line in a horizontal posture.

5. The pre-treatment method of claim 1 , further comprising:
an attaching process of attaching catalytic metal particles on the first coupling layer and the second coupling layer after the second coupling layer forming process.

6. A non-transitory computer-readable medium having stored thereon computer executable instructions that, in response to execution, cause a plating system to perform the pre-treatment method of claim 1 .

Assignees

• Tokyo Electron Ltd

Inventors

• Tanaka Takashi
• Inatomi Yuichiro
• IWAI Kazutoshi
• Iwashita Mitsuaki

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10P14/46

  using a liquid · CPC title

• H10W20/0526

  by thermal treatment thereof · CPC title

• H10W20/044

  for electroless plating · CPC title