Method of metalizing surface and article obtainable

Patent metadata

Field	Value
Publication number	US-9512522-B2
Application number	US-201414315166-A
Country	US
Kind code	B2
Filing date	Jun 25, 2014
Priority date	Dec 27, 2011
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A mthod of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO 2-σ (I), M 1 M 2 p O q (II), 0.05≦σ<1.8, where, M 1 is at least one element selected from a group consisting of groups 2, 9-12 of the periodic table, M 2 is at least one element selected from a group consisting of groups 3-8, 10 and 13 of the periodic table, 0<p≦2, and 0<q<4.

First claim

What is claimed is:

1. A method of metalizing a surface of an insulation substrate comprising:
applying an ink composition onto the surface of the insulation substrate to be metalized to form an ink layer on the insulation substrate;
subjecting the insulation substrate with the ink layer to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; and
plating at least one metal layer on the ink layer;
wherein the ink composition comprises a metal compound and an ink vehicle, and
wherein the metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II,
TiO 2-σ   (I),

M 1 M 2 p O q   (II),

wherein
0.05≦σ<1.8,
M 1 includes at least one element selected from a group consisting of groups 2, 9-12 of the periodic table according to IUPAC nomenclature,
M 2 includes at least one element selected from a group consisting of groups 3-8, 10 and 13 of the periodic table according to IUPAC nomenclature,
0<p≦2, and 0<q<4.

2. The method according to claim 1 , wherein the plating is performed by means of chemical plating or electrical plating.

3. The method according to claim 1 , wherein the insulation substrate includes at least one selected from a group consisting of a glass substrate, a ceramic substrate, and a cement substrate.

4. The method according to claim 1 , wherein based on 100 weight parts of the metal compound, the content of the ink vehicle is about 1 to 30 weight parts.

5. The method according to claim 1 , wherein the metal compound has an average particle size of 1 to 500 nm.

6. The method according to claim 1 , wherein the ink vehicle includes at least one selected from a group consisting of cellulose acetate, polyacrylate-based resin, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyvinyl acetal, polyvinyl acetate, polyvinyl pyrrolidone, and polyphosphonic acid.

7. The method according to claim 1 , wherein the ink composition further comprises a solvent, wherein based on 100 weight parts of the metal compound, the content of the solvent is about 20 to 200 weight parts.

8. The method according to claim 1 , wherein M 1 includes at least one selected from a group consisting of Mg, Ca, Sr, Ba, Co, Ni, Cu, Zn; and
M 2 includes at least one selected from a group consisting of Sc, Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Ru, B, Al, Ga, In.

9. The method according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 11 of the periodic table according to IUPAC nomenclature, and
M 2 includes one element selected from a group consisting of group 8 of the periodic table according to IUPAC nomenclature.

10. The method according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 11 of the periodic table according to IUPAC nomenclature, and M 2 comprises M 21 and M 22 ,
wherein
M 21 includes one element selected from a group consisting of group 8 of the periodic table according to IUPAC nomenclature,
M 22 includes at least one element selected from a group consisting of groups 13 and 7 of the periodic table according to IUPAC nomenclature, and
a molar ratio between M 21 and M 22 is about 1:0.1-10.

11. The method according to claim 10 , wherein M 22 comprises M 221 and M 222 ,
wherein
M 221 includes one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature,
M 222 includes one element selected from a group consisting of group 7 of the periodic table according to IUPAC nomenclature, and
a molar ratio between M 221 and M 222 is about 1:0.1-10.

12. The method according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 2 of the periodic table according to IUPAC nomenclature, and
M 2 includes one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature.

13. The method according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 10 of the periodic table according to IUPAC nomenclature, and
M 2 includes one element selected from a group consisting of group 6 of the periodic table according to IUPAC nomenclature.

14. The method according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 11 of the periodic table according to IUPAC nomenclature, and
M 2 includes one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature, or M 2 comprises one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature and at least one element selected from a group consisting of groups 8 and 10 of the periodic table according to IUPAC nomenclature.

15. The method according to claim 14 , wherein M 2 comprises M 23 and M 24 , wherein
M 23 includes at least one element selected from a group consisting of groups 8, 10 and 13 of the periodic table according to IUPAC nomenclature,
M 24 includes B,
M 23 and M 24 are different, and a molar ratio of M 23 and M 24 is about 1:0.1-10.

16. The method according to claim 1 , wherein the metal compound includes at least one selected from a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, a compound of formula III, CuFe 0.5 Mn 0.5 O 2.5 , CuFe 0.5 Al 0.5 O 2.5 , CuFe 0.5 Al 0.25 Mn 0.5 O 2.5 , a compound of formula IV, a compound of formula V, CuFe 0.5 B 0.5 ,O 2.5 , CuNi 0.5 B 0.5 O 2.5 ,CuGa 0.5 B 0.5 O 2.5 , CuB 0.7 O 2 , and a compound of formula VI,
CuFeO 4-σ (III),
MgGa 2 O 4-λ (IV),
NiMoO 4-μ (V),
Ca α Cu 1-α TiO 3-β (VI),
wherein 0<δ≦3, 0<λ≦3, 0<μ≦3, 0≦α<1 and β is about 0-2.

17. The method according to claim 1 , wherein the insulation substrate with the ink layer is subjected to heat treatment at about 700 to 900 degrees Celsius.

18. The method according to claim 1 , wherein the ink layer has a thickness of about 8 to 50 microns.

19. The method according to claim 1 , wherein applying the ink composition onto the surface to be metalized further comprises:
mixing the ink composition with an inorganic binder to form a mixture; and
applying the mixture onto the surface to be metalized;
wherein based on 100 weight parts of the ink composition, the amount of the inorganic binder is about 1 to 15 weight parts.

20. The method according to claim 19 , wherein the inorganic binder includes at least one selected from a group consisting of SiO 2 , CaO, Na 2 O, ZnO and Ni 2 O 3 .

Assignees

• Shenzhen Byd Auto R&D Co Ltd
• Byd Co Ltd

Inventors

• Miao Weifeng

Classifications

• H05K3/18

  using precipitation techniques to apply the conductive material · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• C09D11/322

  Pigment inks · CPC title

• C09D11/037 Primary

  characterised by the pigment · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title