3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom

Patent metadata

Field	Value
Publication number	US-2020148593-A1
Application number	US-201916666876-A
Country	US
Kind code	A1
Filing date	Oct 29, 2019
Priority date	Nov 13, 2018
Publication date	May 14, 2020
Grant date	—

Abstract

In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO x ) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

First claim

What is claimed is:

1 . A method, comprising:
depositing an adhesion layer comprising manganese oxide (MnO x ) onto a surface of a glass or glass ceramic substrate; depositing a catalyst for electroless copper deposition onto the adhesion layer; depositing by electroless plating a first layer of copper onto the MnO x layer, after depositing the catalyst; and annealing the adhesion layer in a reducing atmosphere.

2 . The method of claim 1 , wherein the adhesion layer is deposited by chemical vapor deposition or atomic layer deposition.

3 . The method of claim 1 , wherein the adhesion layer consists essentially of MnO x .

4 . The method of claim 1 , wherein the adhesion layer consists of MnO x .

5 . The method of claim 1 , wherein the adhesion layer comprises at 50 at % Mn or more, excluding oxygen.

6 . The method of claim 1 , wherein the adhesion layer is annealed in a reducing atmosphere before depositing the catalyst.

7 . The method of claim 1 , wherein the adhesion layer is annealed in a reducing atmosphere after depositing the catalyst.

8 . The method of claim 1 , wherein the adhesion layer is annealed in a reducing atmosphere after depositing the first layer of copper.

9 . The method of claim 1 , wherein the annealing in a reducing atmosphere is performed at a temperature of 200° C. or greater in an atmosphere containing 1% or more by volume of a reducing agent.

10 . The method of claim 1 , further comprising pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

11 . The method of claim 1 , wherein the adhesion layer after annealing includes a layer of MnO x having a thickness of 3 nm or more.

12 . The method of claim 11 , wherein the adhesion layer after annealing includes layer of MnO x having a thickness of 6 nm or more.

13 . The method of claim 12 , wherein the adhesion layer after annealing includes a layer of MnO x having a thickness of 6 nm to 9 nm.

14 . The method of claim 1 , wherein the surface is an interior surface of a via hole formed in the glass or glass ceramic substrate.

15 . The method of claim 1 , further comprising: depositing a second layer of copper, by electrolytic plating, over the first layer of copper.

16 . The method of claim 15 , wherein the second layer of copper has a thickness of 2 μm or more.

17 . The method of claim 15 wherein the second layer of copper is capable of passing a 5 N/cm tape test.

18 . The method of claim 1 , wherein the glass or glass ceramic substrate comprises a material having a bulk composition, in mol % on an oxide basis, of 50% to 100% SiO 2

19 . The method of claim 1 , wherein depositing a catalyst comprises:
charging the adhesion layer by treating with aminosilanes or nitrogen-containing polycations; after charging, adsorbing palladium complexes onto the adhesion layer by treatment with a palladium-containing solution.

20 . A method, comprising:
depositing an adhesion layer comprising manganese oxide (MnO x ) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere.

21 . An article, comprising:
a glass or glass ceramic substrate having a plurality of vias formed therein, each via having an interior surface; a layer of MnO x bonded to the interior surface having a thickness of at least 3 nm; a layer of copper bonded to the layer of MnO x .

Assignees

• Corning Inc

Inventors

• Kim Hoon
• Mazumder Prantik
• Rezikyan Aram
• Vaddi Rajesh

Classifications

• C25D3/38

  of copper · CPC title

• C03C17/3607

  Coatings of the type glass/inorganic compound/metal · CPC title

• C23C18/1637

  metallic substrate · CPC title

• C03C27/048 Primary

  consisting of an adhesive specially adapted for that purpose · CPC title

• C03C17/245

  by deposition from the vapour phase · CPC title