Electroless Deposition Process for Semiconductor Devices
US-2025201565-A1 · Jun 19, 2025 · US
of surfaces of non-metallic or semiconducting in organic material
of surfaces of non-metallic or semiconducting in organic material · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1851 |
| Official title | {of surfaces of non-metallic or semiconducting in organic material} |
| Display label | of surfaces of non-metallic or semiconducting in organic material |
| Total patents | 49 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 18 |
| 2017 | 5 |
| 2018 | 4 |
| 2019 | 6 |
| 2020 | 4 |
| 2021 | 2 |
| 2022 | 1 |
| 2023 | 2 |
| 2024 | 1 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
US-2024140864-A1 · May 2, 2024 · US
Plated material and plating pretreatment method
US-2023407481-A1 · Dec 21, 2023 · US
Anisotropic conductive sheet, electrical inspection device, and electrical inspection method
US-2023106035-A1 · Apr 6, 2023 · US
Apparatus with a substrate provided with plasma treatment
US-11291122-B2 · Mar 29, 2022 · US
Multilayer wiring forming method and recording medium
US-2021358767-A1 · Nov 18, 2021 · US
Method of producing a film-attached resin base
US-11174362-B2 · Nov 16, 2021 · US
Electroless copper plating polydopamine nanoparticles
US-10760162-B2 · Sep 1, 2020 · US
Apparatus with a substrate provided with plasma treatment
US-2020245472-A1 · Jul 30, 2020 · US
Electroless copper plating polydopamine nanoparticles
US-2020157684-A1 · May 21, 2020 · US
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
US-2020148593-A1 · May 14, 2020 · US
Electroless copper plating polydopamine nanoparticles
US-10294567-B2 · May 21, 2019 · US
Electrically-conductive proppant and methods for detecting, locating and characterizing the electrically-conductive proppant
US-2019136122-A1 · May 9, 2019 · US
Film-Attached Resin Base, Method of Producing the Same, and Method of Producing a Film
US-2019091721-A1 · Mar 28, 2019 · US
Method for electrical contact materials including Ag plated CNTs
US-10210965-B2 · Feb 19, 2019 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-10179949-B2 · Jan 15, 2019 · US
Electrically-conductive proppant and methods for detecting, locating and characterizing the electrically-conductive proppant
US-10167422-B2 · Jan 1, 2019 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-10161045-B2 · Dec 25, 2018 · US
Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US-2018350670-A1 · Dec 6, 2018 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-10138557-B2 · Nov 27, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1851?
- CPC C23C18/1851 is the Cooperative Patent Classification code for “of surfaces of non-metallic or semiconducting in organic material.”
- How many patents are filed under CPC C23C18/1851 (of surfaces of non-metallic or semiconducting in organic material)?
- Our database includes 49 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1851 growing?
- Publication counts under this code: 1 in 2024 vs 1 in 2025 (latest complete years).