Electroless copper plating polydopamine nanoparticles

Patent metadata

Field	Value
Publication number	US-10760162-B2
Application number	US-201916414453-A
Country	US
Kind code	B2
Filing date	May 16, 2019
Priority date	Dec 11, 2014
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

Aqueous dispersions of artificially synthesized, mussel-inspired polydopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.

First claim

What is claimed is:

1. A method for forming a conductive trace on a substrate wettable with a volatile liquid, comprising:
providing a suspension of catalytic nanoparticles in the volatile liquid, the catalytic nanoparticles comprising a catalyst for electroless plating;
selectively depositing the suspension of catalytic nanoparticles in the volatile liquid on the substrate by printing a line in a pattern having edges, wherein at least a portion of the substrate remains un-wet by the volatile liquid;
drying the volatile liquid, to form a pattern of catalytic nanoparticles on the substrate, by evaporation of the volatile liquid to redistribute the catalytic nanoparticles according to the coffee ring effect to induce a higher concentration of catalytic nanoparticles in a first region on the substrate at the edges of the printed line and a sparse distribution of catalytic nanoparticles at a second region between the edges of the printed line, and wherein the un-wet portion of the substrate in a third region lacks catalytic nanoparticles; and
selectively electroless plating the nanoparticles, to form a conductive metal pattern corresponding to a distribution of the formed pattern of catalytic nanoparticles in the first region, a non-conductive metal pattern corresponding to the distribution of the formed pattern of catalytic nanoparticles in the second region, and an absent metal pattern the third region.

2. The method according to claim 1 , wherein the substrate comprises at least one of a polyimide sheet and glass.

3. The method according to claim 1 , wherein the catalytic nanoparticles comprise polydopamine.

4. The method according to claim 1 , wherein the suspension of catalytic nanoparticles is selectively deposited by a method selected from the group consisting of inkjet printing, lithography, and a pad printing process.

5. The method according to claim 1 , wherein said drying comprises evaporating the volatile liquid in the suspension at an exposed surface in air.

6. The method according to claim 1 , wherein the electroless plating comprises plating the catalytic nanoparticles with at least one of silver and copper.

7. The method according to claim 1 , wherein the electroless plating forms a pair of separated conductive traces at the edges of an inkjet printed line of the catalytic nanoparticles.

8. The method according to claim 1 , wherein the electroless plating comprises electroless copper plating, resulting in at least one continuous reduced copper trace on the substrate.

9. A patterned substrate having a conductive trace on a substrate wettable with a volatile liquid, formed by a method comprising:
selectively depositing a suspension of catalytic nanoparticles in the volatile liquid, the catalytic nanoparticles comprising a catalyst for electroless plating, on the substrate by printing a line in a pattern having edges, wherein at least a portion of the substrate remains un-wet by the volatile liquid;
drying the volatile liquid, to form a pattern of catalytic nanoparticles on the substrate, by evaporation of the volatile liquid to redistribute the catalytic nanoparticles according to the coffee ring effect to induce a higher concentration of catalytic nanoparticles in a first region on the substrate at the edges of the printed line and a sparse distribution of catalytic nanoparticles at a second region between the edges of the printed line, and wherein the un-wet portion of the substrate in a third region lacks catalytic nanoparticles; and
selectively electroless plating the nanoparticles, to form a conductive metal pattern corresponding to a distribution of the formed pattern of catalytic nanoparticles in the first region, a non-conductive metal pattern corresponding to the distribution of the formed pattern of catalytic nanoparticles in the second region, and an absent metal pattern the third region.

10. The patterned substrate according to claim 9 , wherein the substrate comprises at least one of a polyimide sheet and glass.

11. The patterned substrate according to claim 9 , wherein the catalytic nanoparticles comprise polydopamine.

12. The patterned substrate according to claim 9 , wherein the suspension of catalytic nanoparticles is selectively deposited by a method selected from the group consisting of inkjet printing, lithography, and a pad printing process.

13. The patterned substrate according to claim 9 , wherein the electroless plating comprises plating the catalytic nanoparticles with at least one of silver and copper.

14. The patterned substrate according to claim 9 , wherein the selectively depositing the suspension of catalytic nanoparticles comprises inkjet printing a line, to form a pair of separated conductive traces at the edges of the inkjet printed line.

15. The patterned substrate according to claim 9 , wherein the electroless plating comprises electroless copper plating, resulting in at least one continuous reduced copper trace on the substrate.

16. A method for forming a conductive trace on a substrate, comprising:
providing a suspension of catalytic nanoparticles adapted for electroless plating in a volatile liquid;
depositing the suspension of catalytic nanoparticles on the substrate in a wetting pattern, wherein at least a portion of the substrate remains dry and absent catalytic nanoparticles;
drying the volatile liquid, to selectively form a pattern of catalytic nanoparticles on the substrate corresponding to the wetting pattern, and having an inhomogeneous distribution of catalytic nanoparticles due to redistribution of the catalytic nanoparticles during the drying, comprising a dense region of catalytic nanoparticles at edges of the wetting pattern, and a sparse distribution of catalytic nanoparticles between the edges of the wetting pattern, and a region that remained dry outside the wetting pattern without catalytic nanoparticles; and
electroless plating the catalytic nanoparticles, to form a conductive metal pattern corresponding to the inhomogeneous distribution of the catalytic nanoparticles, comprising a conductive metallized region corresponding to the dense region, and a non-conductive region corresponding to the sparse distribution, separating portions of the conductive metallized region.

17. The method according to claim 16 , wherein the catalytic nanoparticles comprise polydopamine.

18. The method according to claim 16 , wherein the suspension of catalytic nanoparticles is selectively deposited by a method selected from the group consisting of inkjet printing, lithography, and a pad printing process.

19. The method according to claim 16 , wherein the electroless plating comprises plating the catalytic nanoparticles with at least one of silver and copper.

20. The method according to claim 19 , wherein the electroless plating forms a pair of separated conductive traces at the edges of an inkjet printed line of the catalytic nanoparticles.

Assignees

• Univ New York State Res Found

Inventors

• Ma Siyuan
• Liu Liang
• Bromberg Vadim
• Singler Timothy

Classifications

• C23C18/1608 Primary

  from pretreatment step, i.e. selective pre-treatment · CPC title

• H05K2203/1173

  Differences in wettability, e.g. hydrophilic or hydrophobic areas · CPC title

• C23C18/44

  using reducing agents · CPC title

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title