Semiconductor device and method of manufacturing semicondutor device
US-2025391793-A1 · Dec 25, 2025 · US
of metallic material surfaces or of a non-specific material surfaces
of metallic material surfaces or of a non-specific material surfaces · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1803 |
| Official title | {of metallic material surfaces or of a non-specific material surfaces} |
| Display label | of metallic material surfaces or of a non-specific material surfaces |
| Total patents | 55 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 5 |
| 2017 | 9 |
| 2018 | 3 |
| 2019 | 8 |
| 2020 | 2 |
| 2021 | 6 |
| 2022 | 6 |
| 2023 | 3 |
| 2024 | 3 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate liquid processing apparatus and substrate liquid processing method
US-12435426-B2 · Oct 7, 2025 · US
Method of enhancing corrosion resistance of oxidizable materials and components made therefrom
US-12139794-B2 · Nov 12, 2024 · US
Method for producing package substrate for loading semiconductor device
US-11990349-B2 · May 21, 2024 · US
Substrate liquid processing apparatus and substrate liquid processing method
US-2024060186-A1 · Feb 22, 2024 · US
Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US-11795546-B2 · Oct 24, 2023 · US
Composite member
US-11668009-B2 · Jun 6, 2023 · US
Electroless gold plating bath
US-2023111446-A1 · Apr 13, 2023 · US
Electronic device housings with electroless plating layers
US-2022341052-A1 · Oct 27, 2022 · US
Plating method and plating apparatus
US-11447885-B2 · Sep 20, 2022 · US
Semiconductor device and power conversion device
US-11437505-B2 · Sep 6, 2022 · US
Surface treatment method for metal member
US-2022064800-A1 · Mar 3, 2022 · US
Semiconductor device and method of manufacturing same
US-2022049357-A1 · Feb 17, 2022 · US
Method for producing package substrate for loading semiconductor device
US-2022020602-A1 · Jan 20, 2022 · US
Magnetic disc, aluminum alloy substrate for magnetic disc, and production method for aluminum alloy substrate
US-11211088-B2 · Dec 28, 2021 · US
Plating method and plating apparatus
US-2021062354-A1 · Mar 4, 2021 · US
Semiconductor device and power conversion device
US-2021036141-A1 · Feb 4, 2021 · US
Magnetic disc, aluminum alloy substrate for magnetic disc, and production method for aluminum alloy substrate
US-2021012801-A1 · Jan 14, 2021 · US
Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US-2021002770-A1 · Jan 7, 2021 · US
Composite member and method of manufacturing composite member
US-2021002769-A1 · Jan 7, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1803?
- CPC C23C18/1803 is the Cooperative Patent Classification code for “of metallic material surfaces or of a non-specific material surfaces.”
- How many patents are filed under CPC C23C18/1803 (of metallic material surfaces or of a non-specific material surfaces)?
- Our database includes 55 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1803 growing?
- Publication counts under this code: 3 in 2024 vs 2 in 2025 (latest complete years).