Substrate liquid processing apparatus and substrate liquid processing method

Patent metadata

Field	Value
Publication number	US-12435426-B2
Application number	US-202017754573-A
Country	US
Kind code	B2
Filing date	Sep 28, 2020
Priority date	Oct 9, 2019
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A technique advantageous for shortening time required for electroless plating that is performed on a substrate is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold the substrate; a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit configured to accelerate the electroless plating solution with respect to the plating reaction and a reaction heater configured to heat the electroless plating solution; and a plating solution supply configured to supply the electroless plating solution to the substrate held by the substrate holder.

First claim

We claim:

1. A substrate liquid processing apparatus, comprising:
a substrate holder configured to hold a substrate;
a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit configured to accelerate the electroless plating solution with respect to the plating reaction and a reaction heater configured to heat the electroless plating solution; and
a plating solution supply configured to supply the electroless plating solution to the substrate held by the substrate holder,
wherein the activation unit has a catalyst contact unit configured to activate the electroless plating solution with respect to the plating reaction by bringing a catalyst member into contact with the electroless plating solution.

2. The substrate liquid processing apparatus of claim 1 ,
wherein the reaction heater heats the electroless plating solution which has been activated by the activation unit.

3. The substrate liquid processing apparatus of claim 1 ,
wherein the activation unit activates the electroless plating solution, which has been heated by the reaction heater, with respect to the plating reaction.

4. The substrate liquid processing apparatus of claim 1 ,
wherein the plating solution supply supplies the substrate with the electroless plating solution which has been activated by the activation unit.

5. The substrate liquid processing apparatus of claim 1 ,
wherein the activation unit has an activation heater configured to heat the electroless plating solution.

6. The substrate liquid processing apparatus of claim 5 ,
wherein the activation unit has a temperature lowering unit configured to lower a temperature of the electroless plating solution which has been heated by the activation heater.

7. The substrate liquid processing apparatus of claim 1 ,
wherein the catalyst member is in the form of a mesh.

8. The substrate liquid processing apparatus of claim 1 , further comprising:
a reservoir configured to store therein the electroless plating solution which has been activated by the activation unit,
wherein the reaction heater heats the electroless plating solution sent from the reservoir.

9. The substrate liquid processing apparatus of claim 8 ,
wherein the activation unit activates the electroless plating solution in the reservoir.

10. The substrate liquid processing apparatus of claim 1 ,
wherein the reaction heater heats the electroless plating solution flowing in a passage connected to the plating solution supply.

11. A substrate liquid processing method for use with the substrate liquid processing apparatus of claim 1 , the method comprising:
accelerating the plating reaction of the unused electroless plating solution, the accelerating of the plating reaction including activating the electroless plating solution with respect to the plating reaction and heating the electroless plating solution; and
supplying the electroless plating solution to the substrate,
wherein the activating of the electroless plating solution with respect to the plating reaction brings the catalyst member into contact with the electroless plating solution.

Assignees

• Tokyo Electron Ltd

Inventors

• Iwashita Mitsuaki
• Nagao Takeshi

Classifications

• C23C18/168

  Control of temperature, e.g. temperature of bath, substrate · CPC title

• C23C18/1676

  Heating of the solution · CPC title

• C23C18/1619 Primary

  Apparatus for electroless plating · CPC title

• C23C18/1633

  Process of electroless plating · CPC title

• C23C18/1603

  coating on selected surface areas · CPC title