Package architecture utilizing wafer to wafer bonding
US-2024379487-A1 · Nov 14, 2024 · US
US2021002769A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021002769-A1 |
| Application number | US-201916969238-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 30, 2019 |
| Priority date | Feb 14, 2018 |
| Publication date | Jan 7, 2021 |
| Grant date | — |
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A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.
Opening claim text (preview).
1 . A composite member comprising: a substrate formed of a composite material containing a plurality of diamond grains, and a metal phase that bonds the diamond grains; and a coating layer made of metal and coating at least a part of a surface of the substrate, wherein the surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase, in a plan view, the coating layer includes a metal coating portion coating the surface of the metal phase, and a grain coating portion coating the protrusion and not coating the surface of the metal phase, a ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80, and the coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm. 2 . The composite member according to claim 1 , wherein metal that forms the metal phase is silver or a silver alloy. 3 . The composite member according to claim 1 , wherein the metal that forms the coating layer is a nickel alloy containing phosphorus. 4 . A method of manufacturing a composite member, the method comprising: etching a surface of a material plate formed of a composite material containing a plurality of diamond grains and a metal phase that bonds the diamond grains, to produce a rough surface plate in which a part of at least one diamond grain of the diamond grains protrudes from a surface of the metal phase; subjecting the rough surface plate to first electroless plating to produce a partial coating plate in which a first plating layer is formed on the surface of the metal phase while exposing a part of at least one diamond grain of the diamond grains existing on the surface of the material plate; and subjecting the partial coating plate to second electroless plating to form a second plating layer that coats a surface of the first plating layer and a portion of at least one diamond grain of the diamond grains that is exposed from the surface of the first plating layer.
of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title
Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title
Diamond · CPC title
Mixtures of metal powder with non-metallic powder (C22C1/08 takes precedence) · CPC title
Surface feature [e.g., rough, mirror] · CPC title
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