Composite member and method of manufacturing composite member

US2021002769A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021002769-A1
Application numberUS-201916969238-A
CountryUS
Kind codeA1
Filing dateJan 30, 2019
Priority dateFeb 14, 2018
Publication dateJan 7, 2021
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.

First claim

Opening claim text (preview).

1 . A composite member comprising: a substrate formed of a composite material containing a plurality of diamond grains, and a metal phase that bonds the diamond grains; and a coating layer made of metal and coating at least a part of a surface of the substrate, wherein the surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase, in a plan view, the coating layer includes a metal coating portion coating the surface of the metal phase, and a grain coating portion coating the protrusion and not coating the surface of the metal phase, a ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80, and the coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm. 2 . The composite member according to claim 1 , wherein metal that forms the metal phase is silver or a silver alloy. 3 . The composite member according to claim 1 , wherein the metal that forms the coating layer is a nickel alloy containing phosphorus. 4 . A method of manufacturing a composite member, the method comprising: etching a surface of a material plate formed of a composite material containing a plurality of diamond grains and a metal phase that bonds the diamond grains, to produce a rough surface plate in which a part of at least one diamond grain of the diamond grains protrudes from a surface of the metal phase; subjecting the rough surface plate to first electroless plating to produce a partial coating plate in which a first plating layer is formed on the surface of the metal phase while exposing a part of at least one diamond grain of the diamond grains existing on the surface of the material plate; and subjecting the partial coating plate to second electroless plating to form a second plating layer that coats a surface of the first plating layer and a portion of at least one diamond grain of the diamond grains that is exposed from the surface of the first plating layer.

Assignees

Inventors

Classifications

  • of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

  • H10W40/258Primary

    Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

  • Diamond · CPC title

  • Mixtures of metal powder with non-metallic powder (C22C1/08 takes precedence) · CPC title

  • Surface feature [e.g., rough, mirror] · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2021002769A1 cover?
A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coat…
Who is the assignee on this patent?
Sumitomo Electric Industries, Almt Corp
What technology area does this patent fall under?
Primary CPC classification H10W40/258. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jan 07 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).