Composite member

US11668009B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11668009-B2
Application numberUS-201916969238-A
CountryUS
Kind codeB2
Filing dateJan 30, 2019
Priority dateFeb 14, 2018
Publication dateJun 6, 2023
Grant dateJun 6, 2023

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.

First claim

Opening claim text (preview).

The invention claimed is: 1. A composite member comprising: a substrate formed of a composite material containing a plurality of diamond grains, and a metal phase that bonds the diamond grains; and a coating layer made of metal and coating at least a part of a surface of the substrate, wherein the surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase, in a plan view, the coating layer includes a metal coating portion coating the surface of the metal phase, and a grain coating portion coating the protrusion and not coating the surface of the metal phase, a ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is greater than zero and equal to or less than 0.80, at least a part of a surface of the composite member has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm, the diamond grains have a coating film that coats at least a part of a surface of each diamond grain, and the coating film is formed of a carbide of one or more types of metals selected from Ti, Hf, and Zr. 2. The composite member according to claim 1 , wherein metal that forms the metal phase is silver or a silver alloy. 3. The composite member according to claim 1 , wherein the metal that forms the coating layer is a nickel alloy containing phosphorus.

Assignees

Inventors

Classifications

  • of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

  • H10W40/258Primary

    Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

  • Diamond · CPC title

  • Mixtures of metal powder with non-metallic powder (C22C1/08 takes precedence) · CPC title

  • metallic substrate · CPC title

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Frequently asked questions

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What does patent US11668009B2 cover?
A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coat…
Who is the assignee on this patent?
Sumitomo Electric Industries, Almt Corp
What technology area does this patent fall under?
Primary CPC classification H10W40/258. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 06 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).