Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
US-10151035-B2 · Dec 11, 2018 · US
Substrates other than metallic, e.g. inorganic or organic or non-conductive
Substrates other than metallic, e.g. inorganic or organic or non-conductive · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1639 |
| Official title | {Substrates other than metallic, e.g. inorganic or organic or non-conductive} |
| Display label | Substrates other than metallic, e.g. inorganic or organic or non-conductive |
| Total patents | 152 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 19 |
| 2017 | 19 |
| 2018 | 18 |
| 2019 | 26 |
| 2020 | 16 |
| 2021 | 12 |
| 2022 | 8 |
| 2023 | 8 |
| 2024 | 12 |
| 2025 | 7 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for producing noble metal nanocomposites
US-10106895-B2 · Oct 23, 2018 · US
Proppant having non-uniform electrically conductive coatings and methods for making and using same
US-10106732-B2 · Oct 23, 2018 · US
Method for producing noble metal nanocomposites
US-2018282872-A1 · Oct 4, 2018 · US
Method for Manufacturing Polymer-Metal Composite Structural Component
US-2018265985-A1 · Sep 20, 2018 · US
Electroless plating method and ceramic substrate
US-2018199442-A1 · Jul 12, 2018 · US
Magnetic composite powders, preparing method thereof and electromagnetic noise suppressing films comprising same
US-10008311-B2 · Jun 26, 2018 · US
Substrate processing method
US-2018122641-A1 · May 3, 2018 · US
Activation method for silicon substrates comprising at least two aromatic acids
US-9960051-B2 · May 1, 2018 · US
Electroless plating method and ceramic substrate
US-9949374-B2 · Apr 17, 2018 · US
Method for manufacturing polymer-metal composite structural component
US-9920429-B2 · Mar 20, 2018 · US
Antimicrobial silver compositions
US-9888691-B2 · Feb 13, 2018 · US
Method for plating on surface of non-conductive substrate
US-2018030600-A1 · Feb 1, 2018 · US
Silver-coated particle and method of producing same
US-2018016679-A1 · Jan 18, 2018 · US
Composition for forming plating layer, film having plating layer precursor layer, film having patterned plating layer, conductive film, and touch panel
US-2018015697-A1 · Jan 18, 2018 · US
Activation method for silicon substrates
US-2018019137-A1 · Jan 18, 2018 · US
Method of manufacturing metal composite powder by wire explosion in liquid and multi carbon layer coated metal composite powder
US-9855602-B2 · Jan 2, 2018 · US
Shielding coating for selective metallization
US-9850578-B1 · Dec 26, 2017 · US
Electrode-forming composition
US-2017350015-A1 · Dec 7, 2017 · US
Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
US-2017342567-A1 · Nov 30, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1639?
- CPC C23C18/1639 is the Cooperative Patent Classification code for “Substrates other than metallic, e.g. inorganic or organic or non-conductive.”
- How many patents are filed under CPC C23C18/1639 (Substrates other than metallic, e.g. inorganic or organic or non-conductive)?
- Our database includes 152 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1639 growing?
- Publication counts under this code: 12 in 2024 vs 7 in 2025 (latest complete years).