Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts

Patent metadata

Field	Value
Publication number	US-10151035-B2
Application number	US-201615165276-A
Country	US
Kind code	B2
Filing date	May 26, 2016
Priority date	May 26, 2016
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

Walls of through-holes and vias of substrates with dielectric material are electroless plated with copper using tin-free ionic silver catalysts. Conductive polymers are first formed on the substrates by treating the substrates with a permanganate solution containing complexing anions followed by applying monomers, oligomers or conductive polymers to the substrate to form a conductive polymer coating on the dielectric of the substrate as well as on the walls of through-holes and vias of the substrate. A tin-free ionic silver catalyst is then applied to the treated substrate. Optionally, the tin-free ionic silver catalyst can include a ligand agent to form a coordination entity with the silver ions of the tin-free catalyst. The silver ions of the tin-free catalyst are reduced by the conductive polymer and then an electroless metal copper bath is applied to the treated substrate to copper plate the dielectric and walls of the through-holes and vias of the substrate.

First claim

What is claimed is:

1. A method of electroless metal plating comprising:
a) providing a substrate comprising dielectric material and a plurality of features, wherein the plurality of features are chosen from one or more of through-holes and vias;
b) applying an alkaline solution comprising permanganate and one or more complexing anions chosen from molybdate anions, orthovanadate anions, metavanadate anions, arsenate anions, antimonite anions, tungstate anions, zirconate anions and hexafluorozirconate anions to the substrate comprising the dielectric material and the plurality of features;
c) applying a solution comprising one or more monomers, one or more oligomers, one or more conductive polymers or mixtures thereof to the substrate comprising the dielectric material and the plurality of features to form a conductive polymer coating on the dielectric material and in the plurality of features of the substrate;
d) applying a tin-free ionic catalyst comprising silver ions and one or more ligand agents to form a coordination entity with the silver ions, wherein the one or more ligand agents are chosen from organic heterocyclic compounds, thio ethers and organic acids with lone pair electrons to the substrate comprising the dielectric material and the plurality of features with the conductive polymer to reduce the silver ions to silver metal; and
e) electroless plating copper or nickel on the dielectric material and in the plurality of features of the substrate comprising the conductive polymer and the silver metal.

2. The method of electroless metal plating of claim 1 , wherein the one or more monomers are chosen from monomers comprising π conjugation.

3. The method of electroless metal plating of claim 2 , wherein the one or more monomers comprising π conjugation are chosen from pyrrole, thiophene, 3,4-ethylenedioxythiophene, aniline, dopamine and selenophene.

4. The method of electroless plating of claim 1 , wherein the tin-free ionic catalyst further comprises one or more of palladium ions, platinum ions, ruthenium ions, rhodium ions and iridium ions.

5. The method of electroless metal plating of claim 1 , further comprising applying a solvent swell to the substrate comprising the dielectric materials and the plurality of features.

6. The method of electroless metal plating of claim 1 , further comprising applying a conditioner to the substrate comprising the dielectric material and the plurality of features.

7. The method of electroless metal plating of claim 1 , wherein the substrate comprising the dielectric material and the plurality of features further comprises metal-cladding.

8. The method of electroless metal plating of claim 7 , wherein the metal-cladding is copper.

9. The method of claim 1 , wherein a source of molybdate anions are chosen from one or more of sodium molybdate, potassium molybdate and hydrated diammonium dimolybdate.

10. The method of claim 1 , wherein a pH of the alkaline solution is from 11 to 14.

11. The method of claim 10 , wherein the pH of the alkaline solution is from 11 to 12.

12. The method of claim 1 , wherein the alkaline solution further comprises one or more complexing anions chosen from phosphate anions, borate anions and tetraborate anions.

13. The method of claim 12 , wherein the one or more complexing anions is chosen from phosphate anions.

14. The method of claim 13 , wherein a source of the phosphate anions are chosen from one or more of phosphate, hydrogen phosphate, dihydrogen phosphate and polyphosphates.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Naab Benjamin

Classifications

• C23C18/40

  using reducing agents · CPC title

• H05K3/422

  characterised by electroless plating method; pretreatment therefor · CPC title

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1639

  Substrates other than metallic, e.g. inorganic or organic or non-conductive · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title