Composition for forming plating layer, film having plating layer precursor layer, film having patterned plating layer, conductive film, and touch panel

Patent metadata

Field	Value
Publication number	US-2018015697-A1
Application number	US-201715716653-A
Country	US
Kind code	A1
Filing date	Sep 27, 2017
Priority date	Mar 31, 2015
Publication date	Jan 18, 2018
Grant date	—

Abstract

Provided are a composition for forming a plating layer, which is capable of forming a metal layer having excellent conductivity by means of a plating treatment and is capable of forming a plating layer having excellent adhesiveness to the metal layer, as well as a film having a plating layer precursor layer, a film having a plating layer, a conductive film, and a touch panel, each of which uses the composition for forming a plating layer.
The composition for forming a plating layer according to the present invention includes a non-polymerizable polymer having a group capable of interacting with a metal ion, a polyfunctional monomer having two or more polymerizable functional groups, a monofunctional monomer, and a polymerization initiator.

First claim

What is claimed is:

1 . A composition for forming a plating layer, comprising:
a non-polymerizable polymer having a group capable of interacting with a metal ion; a polyfunctional monomer having two or more polymerizable functional groups; a monofunctional monomer; and a polymerization initiator.

2 . The composition for forming a plating layer according to claim 1 ,
wherein the polymer has a repeating unit containing a carboxylic acid group or a sulfonic acid group.

3 . The composition for forming a plating layer according to claim 1 ,
wherein the polymer is poly(meth)acrylic acid.

4 . The composition for forming a plating layer according to claim 2 ,
wherein the polymer is poly(meth)acrylic acid.

5 . The composition for forming a plating layer according to claim 1 ,
wherein at least one of the polyfunctional monomer or the monofunctional monomer has a (meth)acrylamide group.

6 . The composition for forming a plating layer according to claim 2 ,
wherein at least one of the polyfunctional monomer or the monofunctional monomer has a (meth)acrylamide group.

7 . The composition for forming a plating layer according to claim 3 ,
wherein at least one of the polyfunctional monomer or the monofunctional monomer has a (meth)acrylamide group.

8 . The composition for forming a plating layer according to claim 1 ,
wherein the monofunctional monomer contains at least a compound represented by General Formula (1),

where R 0 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R 1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R 2 , R 3 , and R 4 each independently represent a hydrogen atom, a hydroxy group, an alkyl group having 1 to 10 carbon atoms, or a hydrocarbon chain partially having a substituent selected from an ether group, a carbonyl group, a carboxyl group, and a hydroxy group.

9 . The composition for forming a plating layer according to claim 2 ,
wherein the monofunctional monomer contains at least a compound represented by General Formula (1),

where R 0 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R 1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R 2 , R 3 , and R 4 each independently represent a hydrogen atom, a hydroxy group, an alkyl group having 1 to 10 carbon atoms, or a hydrocarbon chain partially having a substituent selected from an ether group, a carbonyl group, a carboxyl group, and a hydroxy group.

10 . The composition for forming a plating layer according to claim 1 ,
wherein the polyfunctional monomer contains at least a tetrafunctional (meth)acrylamide.

11 . The composition for forming a plating layer according to claim 2 ,
wherein the polyfunctional monomer contains at least a tetrafunctional (meth)acrylamide.

12 . The composition for forming a plating layer according to claim 1 ,
wherein the content of the monofunctional monomer is 10 to 100,000 parts by mass with respect to 100 parts by mass of the polyfunctional monomer.

13 . The composition for forming a plating layer according to claim 2 ,
wherein the content of the monofunctional monomer is 10 to 100,000 parts by mass with respect to 100 parts by mass of the polyfunctional monomer.

14 . The composition for forming a plating layer according to claim 1 ,
wherein the total content of the polyfunctional monomer and the monofunctional monomer is 10 to 1,000 parts by mass with respect to 100 parts by mass of the polymer.

15 . The composition for forming a plating layer according to claim 2 ,
wherein the total content of the polyfunctional monomer and the monofunctional monomer is 10 to 1,000 parts by mass with respect to 100 parts by mass of the polymer.

16 . A film having a plating layer precursor layer, comprising:
a substrate; and a plating layer precursor layer formed of the composition for forming a plating layer according to claim 1 on the substrate.

17 . The film having a plating layer precursor layer according to claim 16 , further comprising:
a primer layer between the substrate and the plating layer precursor layer.

18 . A film having a patterned plating layer,
wherein the plating layer precursor layer the film having a plating layer precursor layer according to claim 16 is cured in a patternwise manner by energy application to form a patterned plating layer.

19 . A conductive film obtained by laminating a metal layer on the patterned plating layer of the film having a patterned plating layer according to claim 18 .

20 . A touch panel comprising:
the conductive film according to claim 19 .

Assignees

• Fujifilm Corp

Inventors

• Ichiki Takahiko

Classifications

• B32B27/36

  comprising polyesters · CPC title

• C23C18/18

  Pretreatment of the material to be coated · CPC title

• C25D5/56

  of plastics · CPC title

• B32B15/08 Primary

  of synthetic resin · CPC title

• B32B2255/26

  Polymeric coating · CPC title