Coating and electronic component

Patent metadata

Field	Value
Publication number	US-2017130337-A1
Application number	US-201715415493-A
Country	US
Kind code	A1
Filing date	Jan 25, 2017
Priority date	Jul 20, 2010
Publication date	May 11, 2017
Grant date	—

Abstract

A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.

First claim

What is claimed is:

1 . A manufacturing method of a coating provided on a conductor, the coating including a first layer and a second layer deposited on the first layer such that the first layer is between the conductor and the second layer, the first layer having an inside layer and an outside layer from the conductor side, the manufacturing method comprising:
a first palladium plating step of forming the inside layer on the conductor; a second palladium plating step of forming the outside layer on the inside layer; and a gold plating step of forming the second layer on the outside layer, the first layer containing palladium, the first layer being deposited on and in direct contact with the conductor without an intervening layer, the conductor being made of copper, silver, or alloy thereof; and the second layer containing gold, wherein the outside layer has a phosphorus concentration and the inside layer has a phosphorus concentration, and the phosphorus concentration in the inner layer is not more than 0.01% by mass and the phosphorus concentration in the outer layer is more than 0.01% by mass and not more than 7% by mass, the phosphorus concentration of the outer layer decreasing with decreasing distance to the conductor, by gradually adding a phosphorus-containing component in a plating solution during the second palladium planting step.

2 . The manufacturing method according to claim 1 , wherein the first layer has a thickness between 0.1 and 0.4 μm.

3 . An electronic component comprising a signal transmission part having a conductor and a coating provided on the conductor, the coating being manufactured according to the method of claim 1 .

Assignees

• Tdk Corp

Inventors

• Yoshida Kenichi
• Horikawa Yuhei
• Sato Atsushi
• Abe Hisayuki

Classifications

• H10W72/01935

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title