Horizontal method of electroless metal plating of substrates with ionic catalysts

Patent metadata

Field	Value
Publication number	US-2017251557-A1
Application number	US-201615056196-A
Country	US
Kind code	A1
Filing date	Feb 29, 2016
Priority date	Feb 29, 2016
Publication date	Aug 31, 2017
Grant date	—

Abstract

Horizontal methods of electroless metal plating with ionic catalysts have improved plating performance by reducing undesired foaming. The reduced foaming prevents loss of ionic catalyst from the catalyst bath and prevents scum formation which inhibits catalyst performance. The horizontal methods also inhibit ionic catalyst precipitation and improve adhesion of the ionic catalyst to the substrate. The horizontal method can be used to plate through-holes and vias of various types of substrates.

First claim

1 . A horizontal method of electroless plating a substrate comprising:
a) cleaning and conditioning the substrate; b) microetching the substrate; c) providing an aqueous acid pre-dip composition consisting of one or more compounds having a formula:

wherein R 1 , R 2 , R 3 , R 4 and R 5 are independently chosen from hydrogen, linear or branched (C 1 -C 4 )alkyl, halide, NH 2 , NO 2 , SO 3 H, OH, acyl, (C 1 -C 4 )alkoxy and benzoyl, and Z is OY or benzoyl, wherein Y is hydrogen, halide or alkali metal cation; and optionally one or more buffering agents;
d) applying the aqueous acid pre-dip composition to the substrate;
e) applying an ionic catalyst to the substrate, wherein the ionic catalyst comprises a complexing agent and one or more metal ions;
f) applying a reducing agent to the substrate with the ionic catalyst; and
g) applying an electroless metal plating bath to the substrate with the catalyst to metal plate the substrate.

2 . The horizontal method of claim 1 , wherein the one or more buffers are chosen from alkali metal hydroxides.

3 . The horizontal method of claim 1 , wherein the one or more buffers are chosen from nitric acid.

4 . The horizontal method of claim 1 , wherein the one or more metal ions of the ionic catalyst are chosen from palladium, platinum, and gold.

5 . The horizontal method of claim 1 , wherein the complexing agent of the ionic catalyst is a heterocyclic nitrogen compound.

6 . The horizontal method of claim 5 , wherein the heterocyclic nitrogen compound is chosen from pyrimidine derivatives, pyrazine and pyridine derivatives.

7 . The horizontal method of claim 6 , wherein the pyrazine derivatives are chosen from 2,6-dimethylpyrazine, 2,3-dimethylpyrazine, 2,5-dimethylpyrazine, 2,3,5-trimethylpyraizine, 2-acetylpyrazine, aminopyrazine, ethylpyrazine, methoxypyrazine, 3,4-dimethylpyrazine and 2-(2′-hydroxyethyl)pyrazine.

8 . The horizontal method of claim 6 , wherein the pyrimidine derivatives are chosen from uracil, barbituric acid, orotic acid, thymine, 2-aminopyrimidine, 6-hydroxy-2,4-dimethylpyrimidine, 6-methyluracil, 2-hydroxypyrimidine, 4,6-dichloropyrimidine, 2,4-dimethoxypyrimidine, 2-amino-4,6-dimethylpyrimidine, 2-hydroxy-4,6-dimethylpyrimidine and 6-methylisocytosine.

9 . The horizontal method of claim 6 , wherein the pyridine derivatives are chosen from 4-dimethylaminopyridine, 4-aminopyridine, 2-aminopyridine, 4-(methylamino)pyridine, 2-(methylamino)pyridine, 2-amino-4,6-dimethylpyridine, 2-dimethylamino-4,6-dimethylpyridine, 4-diethylaminopyridine, 2-(pyridin-3-yl)-acetic acid, 2-amino-3-(pyridin-3-yl)-propionic acid, 2-amino-3-(pyridin-2-yl)-propionic acid, 3-(pyridin-3-yl)-acrylic acid, 3-(4-methylpyridin-2-yl)acrylic acid and 3-(pyridin-3-yl)-acrylamide

10 . The horizontal method of claim 1 , wherein a pH of the aqueous acid pre-dip composition is less than 7.

11 . The Horizontal method of claim 1 , wherein the substrate comprises a plurality of through-holes, vias or combinations thereof.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Liu Feng
• Rzeznik Maria

Classifications

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10P14/46

  using a liquid · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H10W20/044

  for electroless plating · CPC title