Solder-coated ball and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-2017274478-A1
Application number	US-201515503939-A
Country	US
Kind code	A1
Filing date	Jul 16, 2015
Priority date	Aug 18, 2014
Publication date	Sep 28, 2017
Grant date	—

Abstract

A solder-coated ball ( 10 A) includes a spherical core containing Ni and P; and a solder layer ( 12 ) formed to coat the core ( 11 ). A solder-coated ball ( 10 B) further includes a Cu plating layer ( 13 ) formed between the core ( 11 ) and the solder layer ( 12 ). A solder-coated ball ( 10 C) further includes an Ni plating layer ( 14 ) formed between the Cu plating layer ( 13 ) and the solder layer ( 12 ).

First claim

1 . A solder-coated ball, comprising:
a spherical core containing Ni and P; and a solder layer formed to coat the core.

2 . The solder-coated ball according to claim 1 , further comprising a Cu plating layer formed between the core and the solder layer.

3 . The solder-coated ball according to claim 2 , further comprising an Ni plating layer formed between the Cu plating layer and the solder layer.

4 . The solder-coated ball according to claim 2 , wherein the Cu plating layer has a thickness of 0.01 μm or greater and 50 μm or less.

5 . The solder-coated ball according to claim 1 , wherein the solder layer has a thickness of 0.01 μm or greater and 50 μm or less.

6 . The solder-coated ball according to claim 1 , wherein the core has an average particle diameter of 150 μm or less and a sphericity of 0.98 or greater.

7 . The solder-coated ball according to claim 1 , wherein the core contains P at 1% by mass or greater and 15% by mass or less, Cu optionally incorporated at 18% by mass at most and Sn optionally incorporated at 5% by mass at most, and the remaining part contains Ni and unavoidable impurities.

8 . A method for manufacturing solder-coated ball comprising a spherical core containing Ni and P, and a solder layer formed to coat the core, the method comprising a step of preparing the core,
wherein the step includes a step of manufacturing, by an electroless reduction method, a powder of spherical particles containing Ni and P, the powder fulfilling [(d90−d10)/d50]≦0.8, where particles exhibiting 90% by volume, 10% by volume and 50% by volume in an accumulated volume distribution curve obtained by a laser diffraction/scattering method respectively have particle diameters of d90, d10 and d50.

9 . The method for manufacturing the solder-coated ball according to claim 8 , further comprising a step of forming a solder layer by electrolytic plating, the solder layer coating the core.

Assignees

• Hitachi Metals Ltd

Inventors

• Nozaka Tsutomu
• Mori Hidehito

Classifications

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/232

  Plan-view shape, i.e. in top view · CPC title

• H10W72/223

  characterised by the structure of the outermost layers, e.g. multilayered coatings · CPC title

• H10W72/222

  Multilayered bumps, e.g. a coating on top and side surfaces of a bump core · CPC title