Plating bath composition and method for electroless plating of palladium

Patent metadata

Field	Value
Publication number	US-9758874-B2
Application number	US-201515120135-A
Country	US
Kind code	B2
Filing date	Apr 7, 2015
Priority date	Apr 10, 2014
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect. The plating bath has an increased stability against undesired decomposition while maintaining a sufficient plating rate.

First claim

The invention claimed is:

1. An aqueous acidic plating bath composition for electroless deposition of palladium, comprising
(i) a source for palladium ions,
(ii) a nitrogenated complexing agent for palladium ions,
(iii) a reducing agent selected from the group consisting of formic acid, derivatives and salts thereof,
(iv) a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect, and
wherein the at least one hydrophilic residue is selected from the group consisting of hydroxyl, carboxyl, sulfonate and salts thereof; and
wherein the at least one residue having a negative mesomeric effect is selected from the group consisting of nitro, nitrile, acetyl, carboxyl and sulfonate.

2. The aqueous acidic plating bath composition according to claim 1 wherein the source for palladium ions is selected from the group consisting of palladium chloride, palladium nitrate, palladium acetate, palladium sulfate, palladium perchlorate, di-chlorodiethylenediamine palladium, dinitrodiethylenediamine palladium and diacetatodiethylenediamine palladium.

3. The aqueous acidic plating bath composition according to claim 1 wherein the concentration of palladium ions in the plating bath ranges from 0.5 to 500 mmol/l.

4. The aqueous acidic plating bath composition according to claim 1 wherein the nitrogenated complexing agent for palladium ions is selected from the group consisting of primary amines, secondary amines and tertiary amines.

5. The aqueous acidic plating bath composition according to claim 1 wherein a mole ratio of the nitrogenated complexing agent for palladium ions and palladium ions in the electroless plating bath ranges from 2:1 to 50:1.

6. The aqueous acidic plating bath composition according to claim 1 wherein the formic acid derivative is selected from the group consisting of esters of formic acid and substituted and unsubstituted amides of formic acid.

7. The aqueous acidic plating bath composition according to claim 1 wherein the concentration of the reducing agent ranges from 10 to 1000 mmol/l.

8. The aqueous acidic plating bath composition according to claim 1 wherein the pH-value ranges from 4 to 7.

9. The aqueous acidic plating bath composition according to claim 1 wherein the water-soluble stabilizing agent is selected from the group consisting of 2-nitrophenol, 3-nitrophenol, 4-nitrophenol, 3,5-dinitrophenol, 2,4-dinitrophenol, 2,4,6-trinitrophenol, 2-nitrobenzoic acid, 3-nitrobenzoic acid, 4-nitrobenzoic acid, 3,5-dinitrobenzoic acid, 2,4-dinitrobenzoic acid, 2,4,6-trinitrobenzoic acid, 2-hydroxy-3, 5-dinitrobenzoic acid, 2-nitrobenzosulfonic acid, 3-nitrobenzosulfonic acid, 4-nitrobenzosulfonic acid, 3,5-dinitrobenzosulfonic acid, 2,4-dinitrobenzosulfonic acid, 2,4,6-trinitrobenzosulfonic acid, 2-acetylbenzoic acid, 3-acetylbenzoic acid, 4-acetylbenzoic acid, 3,5-diacetylbenzoic acid, 2,4-diacetylbenzoic acid, 2,4,6-triacetylbenzoic acid, 2-acetylphenol,3-acetylphenol, 4-acetylphenol, 3,5-diacetylphenol, 2,4-diacetylphenol, 2,4,6-triacetylphenol, 2-acetylbenzosulfonic acid, 3-acetylbenzosulfonic acid, 4-acetyl-benzosulfonic acid, 3,5-diacetylbenzosulfonic acid, 2,4-diacetylbenzosulfonic acid, 2,4,6-triacetylbenzosulfonic acid, 2-cyanobenzoic acid, 3-cyanobenzoic acid, 4-cyanobenzoic acid, 2-hydroxybenzonitrile, 3-hydroxybenzonitrile, 4-hydroxybenzonitrile, and their corresponding ammonium, sodium and potassium salts.

10. The aqueous acidic plating bath composition according to claim 1 wherein the water-soluble stabilizing agent is selected from the group consisting of 2-nitrobenzoic acid, 3-nitrobenzoic acid, 4-nitrobenzoic acid, 3,5-dinitrobenzoic acid, 2,4-dinitrobenzoic acid, 2,4,6-trinitrobenzoic acid, 2-hydroxy-3,5-dinitrobenzoic acid and their corresponding ammonium, sodium and potassium salts.

11. The aqueous acidic plating bath composition according to claim 1 wherein the concentration of the stabilizing agent ranges from 1 to 200 mg/l.

12. A method for electroless palladium plating comprising, in this order, the steps of
a) providing a substrate having a metal surface,
b) providing an aqueous acidic plating bath composition according to claim 1 ,
c) contacting said substrate with said aqueous acidic plating bath composition and thereby depositing a layer of palladium onto the metal surface of the substrate.

13. The method for electroless palladium plating according to claim 12 wherein the substrate is contacted with the aqueous acidic plating bath composition at a temperature of 35 to 95° C. for 1 to 60 min in step c).

Assignees

• Atotech Deutschland Gmbh

Inventors

• Suchentrunk Christof
• Grummt Katharina
• Cramer Julia

Classifications

• H10P14/46

  using a liquid · CPC title

• H05K3/187

  means therefor, e.g. baths, apparatus · CPC title

• C23C18/44 Primary

  using reducing agents · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title

• C23C18/1637

  metallic substrate · CPC title