Plasma enhanced CVD with periodic high voltage bias
US-10840086-B2 · Nov 17, 2020 · US
using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515 · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C16/517 |
| Official title | using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515 |
| Display label | using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515 |
| Total patents | 157 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 6 |
| 2017 | 14 |
| 2018 | 10 |
| 2019 | 14 |
| 2020 | 14 |
| 2021 | 16 |
| 2022 | 17 |
| 2023 | 16 |
| 2024 | 18 |
| 2025 | 16 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus and method for depositing a coating on a substrate at atmospheric pressure
US-10752994-B2 · Aug 25, 2020 · US
Apparatus and method for coating and in particular plasma coating of containers
US-2020194232-A1 · Jun 18, 2020 · US
Methods for depositing dielectric material
US-2020090946-A1 · Mar 19, 2020 · US
Tandem source activation for CVD of films
US-10577688-B2 · Mar 3, 2020 · US
Systems and methods of control for plasma processing
US-2020058469-A1 · Feb 20, 2020 · US
Etching apparatus
US-2019393053-A1 · Dec 26, 2019 · US
Substrate processing apparatus
US-2019393057-A1 · Dec 26, 2019 · US
Apparatus for radical-based deposition of dielectric films
US-10480074-B2 · Nov 19, 2019 · US
Plasma enhanced cvd with periodic high voltage bias
US-2019333764-A1 · Oct 31, 2019 · US
Plasma processing apparatus with shower plate having protrusion for suppressing film formation in gas holes of shower plate
US-10443130-B2 · Oct 15, 2019 · US
Film forming method, boron film, and film forming apparatus
US-10388524-B2 · Aug 20, 2019 · US
Method for manufacturing semiconductor device
US-2019189454-A1 · Jun 20, 2019 · US
Production Method and Production Device for Nitrogen Compound
US-2019153617-A1 · May 23, 2019 · US
Plasma processing apparatus
US-2019131108-A1 · May 2, 2019 · US
Method of manufacturing metal oxide film and display device including metal oxide film
US-2019115409-A1 · Apr 18, 2019 · US
Apparatus and method for depositing a coating on a substrate at atmospheric pressure
US-2019093229-A1 · Mar 28, 2019 · US
Plasma processing apparatus
US-10217613-B2 · Feb 26, 2019 · US
Method for forming metal oxide layer, and plasma-enhanced chemical vapor deposition device
US-2019051520-A1 · Feb 14, 2019 · US
Apparatus and method for depositing a coating on a substrate at atmospheric pressure
US-10167556-B2 · Jan 1, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C16/517?
- CPC C23C16/517 is the Cooperative Patent Classification code for “using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515.”
- How many patents are filed under CPC C23C16/517 (using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515)?
- Our database includes 157 publications tagged with this CPC code.
- Is patent activity under CPC C23C16/517 growing?
- Publication counts under this code: 18 in 2024 vs 16 in 2025 (latest complete years).