Bonding wire for semiconductor devices
US-12412864-B2 · Sep 9, 2025 · US
with cadmium as the next major constituent
with cadmium as the next major constituent · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C5/10 |
| Official title | with cadmium as the next major constituent |
| Display label | with cadmium as the next major constituent |
| Total patents | 25 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 5 |
| 2017 | 4 |
| 2018 | 5 |
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 2 |
| 2022 | 2 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bonding wire for semiconductor devices
US-11342299-B2 · May 24, 2022 · US
Bonding wire for semiconductor devices
US-2022108971-A1 · Apr 7, 2022 · US
Materials for near field transducers and near field transducers containing same
US-11107499-B2 · Aug 31, 2021 · US
Materials for near field transducers, near field tranducers containing same, and methods of forming
US-10964347-B2 · Mar 30, 2021 · US
Materials for near field transducers and near field transducers containing same
US-2020227086-A1 · Jul 16, 2020 · US
Materials for near field transducers and near field transducers containing same
US-10482914-B2 · Nov 19, 2019 · US
Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
US-10381320-B2 · Aug 13, 2019 · US
Materials for near field transducers and near field transducers containing same
US-2019088280-A1 · Mar 21, 2019 · US
Bonding wire for semiconductor devices
US-2018374816-A1 · Dec 27, 2018 · US
Materials for near field transducers and near field transducers containing same
US-2018366153-A1 · Dec 20, 2018 · US
Materials for near field transducers and near field transducers containing same
US-10134436-B2 · Nov 20, 2018 · US
Materials for near field transducers and near field transducers containing same
US-2018137889-A1 · May 17, 2018 · US
Materials for near field transducers and near field transducers containing same
US-9870793-B2 · Jan 16, 2018 · US
Silver and copper alloyed rivet contact
US-9666382-B2 · May 30, 2017 · US
Bonding wire for semiconductor device
US-2017110430-A1 · Apr 20, 2017 · US
Materials for near field transducers, near field tranducers containing same, and methods of forming
US-2017069342-A1 · Mar 9, 2017 · US
Metal material for electronic component and method for manufacturing the same
US-9576693-B2 · Feb 21, 2017 · US
Materials for near field transducers, near field tranducers containing same, and methods of forming
US-9502070-B2 · Nov 22, 2016 · US
Materials for near field transducers and near field transducers containing same
US-2016189735-A1 · Jun 30, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C22C5/10?
- CPC C22C5/10 is the Cooperative Patent Classification code for “with cadmium as the next major constituent.”
- How many patents are filed under CPC C22C5/10 (with cadmium as the next major constituent)?
- Our database includes 25 publications tagged with this CPC code.
- Is patent activity under CPC C22C5/10 growing?
- Publication counts under this code: 2 in 2022 vs 1 in 2025 (latest complete years).