Silver and copper alloyed rivet contact

US9666382B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9666382-B2
Application numberUS-201314784739-A
CountryUS
Kind codeB2
Filing dateDec 13, 2013
Priority dateMay 2, 2013
Publication dateMay 30, 2017
Grant dateMay 30, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is a rivet contact including a head portion and a foot portion having a smaller width than the head portion, wherein the head portion contains a contact material layer having at least a top containing an Ag-based contact material; the rest of the head portion and the foot portion contain a base material containing Cu or a Cu alloy; and a barrier layer including an Ag alloy is provided at a junction interface between the contact material and the base material. Here, an Ag alloy obtained in such a manner that one or more base metal elements of Sn, In, Cu, Ni, Fe, Co, W, Mo, Zn, Cd, Te, and Bi are added to Ag by 0.03 to 20 mass % is preferably used as the Ag alloy constituting the barrier layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A rivet contact comprising a head portion and a foot portion having a smaller width than the head portion, wherein the head portion has a contact material layer having at least a top comprising an Ag-based contact material, a rest of the head portion and the foot portion comprise a base material containing Cu or a Cu alloy, and a barrier layer comprising an Ag alloy is provided at a junction interface between the contact material layer and the base material. 2. The rivet contact according to claim 1 , wherein the Ag-based contact material is pure Ag, an Ag alloy, or an Ag-oxide alloy. 3. The rivet contact according to claim 1 , wherein a thickness of the barrier layer is 0.03 mm to 0.3 mm. 4. The rivet contact according to claim 3 , wherein the Ag-based contact material is pure Ag, an Ag alloy, or an Ag-oxide alloy. 5. The rivet contact according to claim 1 , wherein the Ag alloy constituting the barrier layer is an Ag alloy obtained in such a manner that one or more base metal elements of Sn, In, Cu, Ni, Fe, Co, W, Mo, Zn, Cd, Te, and Bi are added to Ag by 0.03 to 20 mass %. 6. The rivet contact according to claim 5 , wherein the Ag alloy constituting the barrier layer is an Ag alloy obtained in such a manner that Cu is added to Ag by 0.5 to 20 mass %. 7. The rivet contact according to claim 5 , wherein a thickness of the barrier layer is 0.03 mm to 0.3 mm. 8. The rivet contact according to claim 5 , wherein the Ag-based contact material is pure Ag, an Ag alloy, or an Ag-oxide alloy. 9. The rivet contact according to claim 1 , wherein the Ag alloy constituting the barrier layer is an Ag alloy obtained in such a manner that Cu is added to Ag by 0.5 to 20 mass %. 10. The rivet contact according to claim 9 , wherein a thickness of the barrier layer is 0.03 mm to 0.3 mm. 11. The rivet contact according to claim 9 , wherein the Ag-based contact material is pure Ag, an Ag alloy, or an Ag-oxide alloy. 12. The rivet contact according to claim 9 , wherein the Ag alloy constituting the barrier layer is also an Ag alloy obtained in such a manner that Ni is added by 0.03 to 1.0 mass %. 13. The rivet contact according to claim 12 , wherein a thickness of the barrier layer is 0.03 mm to 0.3 mm. 14. The rivet contact according to claim 12 , wherein the Ag-based contact material is pure Ag, an Ag alloy, or an Ag-oxide alloy. 15. A method of manufacturing the rivet contact defined in claim 1 , the method comprising the steps of: butt press-joining a first billet containing a contact material, a second billet containing an Ag alloy, and a third billet containing a base material to each other to manufacture a composite material; forming a rivet-shaped space by a combination of a junction punch having a recessed space and a junction die having a cylindrical space; press-fitting the composite material into the space of the junction punch from a lower part of the junction die; and filling the space with the first billet inside the junction punch to form a contact material layer constituting at least a top layer of a head portion, and filling the second billet and the third billet in a residual space inside the junction punch simultaneously to form the rest of the head portion, a barrier layer, and a foot portion. 16. The method of manufacturing the rivet contact according to claim 15 , wherein the first billet, the second billet, and the third billet are press-joined to each other by a load of 0.8 to 3.0 ton·f in the process of manufacturing the composite material. 17. The method of manufacturing the rivet contact according to claim 15 , comprising the step of forming a top of the head portion by press forming after forming the head portion and the foot portion. 18. A method of manufacturing the rivet contact defined in claim 5 , the method comprising the steps of: butt press-joining a first billet containing a contact material, a second billet containing an Ag alloy, and a third billet containing a base material to each other to manufacture a composite material; forming a rivet-shaped space by a combination of a junction punch having a recessed space and a junction die having a cylindrical space; press-fitting the composite material into the space of the junction punch from a lower part of the junction die; and filling the space with the first billet inside the junction punch to form a contact material layer constituting at least a top layer of a head portion, and filling the second billet and the third billet in a residual space inside the junction punch simultaneously to form the rest of the head portion, a barrier layer, and a foot portion. 19. A method of manufacturing the rivet contact defined in claim 9 , the method comprising the steps of: butt press-joining a first billet containing a contact material, a second billet containing an Ag alloy, and a third billet containing a base material to each other to manufacture a composite material; forming a rivet-shaped space by a combination of a junction punch having a recessed space and a junction die having a cylindrical space; press-fitting the composite material into the space of the junction punch from a lower part of the junction die; and filling the space with the first billet inside the junction punch to form a contact material layer constituting at least a top layer of a head portion, and filling the second billet and the third billet in a residual space inside the junction punch simultaneously to form the rest of the head portion, a barrier layer, and a foot portion. 20. A method of manufacturing the rivet contact defined in claim 12 , the method comprising the steps of: butt press-joining a first billet containing a contact material, a second billet containing an Ag alloy, and a third billet containing a base material to each other to manufacture a composite material; forming a rivet-shaped space by a combination of a junction punch having a recessed space and a junction die having a cylindrical space; press-fitting the composite material into the space of the junction punch from a lower part of the junction die; and filling the space with the first billet inside the junction punch to form a contact material layer constituting at least a top layer of a head portion, and filling the second billet and the third billet in a residual space inside the junction punch simultaneously to form the rest of the head portion, a barrier layer, and a foot portion.

Assignees

Inventors

Classifications

  • H01H1/023Primary

    having a noble metal as the basic material · CPC title

  • with copper as the next major constituent · CPC title

  • with the help of an intermediate layer (contacts provided with a solder layer H01H1/0231) · CPC title

  • with cadmium as the next major constituent · CPC title

  • Alloys based on silver · CPC title

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What does patent US9666382B2 cover?
The present invention is a rivet contact including a head portion and a foot portion having a smaller width than the head portion, wherein the head portion contains a contact material layer having at least a top containing an Ag-based contact material; the rest of the head portion and the foot portion contain a base material containing Cu or a Cu alloy; and a barrier layer including an Ag alloy…
Who is the assignee on this patent?
Tanaka Precious Metal Ind
What technology area does this patent fall under?
Primary CPC classification H01H1/023. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 30 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).