Method of forming a cured epoxy material, cured epoxy material formed thereby, phenylene ether oligomer-anhydride reaction product useful in the method, and composite core incorporating the cured epoxy material
US-2018319930-A1 · Nov 8, 2018 · US
modified by chemical after-treatment
modified by chemical after-treatment · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08L71/126 |
| Official title | {modified by chemical after-treatment} |
| Display label | modified by chemical after-treatment |
| Total patents | 371 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 19 |
| 2017 | 19 |
| 2018 | 26 |
| 2019 | 33 |
| 2020 | 43 |
| 2021 | 44 |
| 2022 | 39 |
| 2023 | 44 |
| 2024 | 50 |
| 2025 | 36 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Polyamide molding compound and use thereof
US-10106681-B2 · Oct 23, 2018 · US
Modified poly (arylene ether) resin composition, method of preparing the same and molded article produced thereof
US-10072149-B2 · Sep 11, 2018 · US
Thermosetting resin composition and prepreg as well as hardened product using the same
US-10023707-B2 · Jul 17, 2018 · US
Reinforced poly(phenylene ether) compositions, and articles prepared therefrom
US-2018155547-A1 · Jun 7, 2018 · US
Resin composition, molded article, and resin modifier
US-2018134890-A1 · May 17, 2018 · US
Resin composition, prepreg, laminate, and printed wiring board
US-9902851-B2 · Feb 27, 2018 · US
Active ester, thermosetting resin composition, prepreg and laminated board containing same
US-2018050515-A1 · Feb 22, 2018 · US
Resin composition and pre-preg and laminate using the composition
US-2018037736-A1 · Feb 8, 2018 · US
Magnetic compound, antenna, and electronic device
US-2018033530-A1 · Feb 1, 2018 · US
Halogen-free resin composition and uses thereof
US-9840620-B2 · Dec 12, 2017 · US
Resin composition, prepreg, metal-clad laminate, and wiring board
US-2017354033-A1 · Dec 7, 2017 · US
Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same
US-2017342264-A1 · Nov 30, 2017 · US
Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
US-9828466-B2 · Nov 28, 2017 · US
Rubber composition comprising a polyphenylene ether resin as plasticizer
US-9822247-B2 · Nov 21, 2017 · US
Halogen-free resin composition and use thereof
US-9771479-B2 · Sep 26, 2017 · US
Resin composition, prepreg and metal-foil-clad laminate
US-9743515-B2 · Aug 22, 2017 · US
Curable composition, prepreg, metal foil with resin, metal-clad laminate and printed wiring board
US-2017226302-A1 · Aug 10, 2017 · US
Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board
US-9708468-B2 · Jul 18, 2017 · US
Modified poly(arylene ether) resin composition and molded article produced thereof
US-2017198140-A1 · Jul 13, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08L71/126?
- CPC C08L71/126 is the Cooperative Patent Classification code for “modified by chemical after-treatment.”
- How many patents are filed under CPC C08L71/126 (modified by chemical after-treatment)?
- Our database includes 371 publications tagged with this CPC code.
- Is patent activity under CPC C08L71/126 growing?
- Publication counts under this code: 50 in 2024 vs 36 in 2025 (latest complete years).