Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same

Patent metadata

Field	Value
Publication number	US-9828466-B2
Application number	US-201515301655-A
Country	US
Kind code	B2
Filing date	Apr 6, 2015
Priority date	Apr 4, 2014
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative:

wherein R 1 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, R 2 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 1 represents a residual group represented by a specific general formula, m is an integer of 1 or more as the number of the structural unit, and x and y each is an integer of 1 to 4.

First claim

The invention claimed is:

1. A polyphenylene ether derivative (A) having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule:

wherein R 1 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, R 2 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 1 represents a residual group represented by one of the following general formulas (II), (Ill), (IV), or (V), m is an integer of 1 or more as the number of the structural unit, and x and y are each an integer of 1 to 4,

wherein R 3 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and p is an integer of 1 to 4,

wherein R 4 and R 5 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 2 represents an alkylene group or alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a ketone group, a single bond, or a residual group represented by the following general formula (III-1), and q and r are each an integer of 1 to 4,

wherein R 6 and R 7 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 3 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a ketone group, or a single bond, and s and t are each an integer of 1 to 4,

wherein n is an integer of 1 to 10,

wherein R 8 and R 9 each independently represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and u is an integer of 1 to 8.

2. The polyphenylene ether derivative (A) according to claim 1 , wherein the N-substituted maleimide group comprises at least one represented by the following formulas (I-1), (I-2), or (I-3):

wherein m is as defined for the general formula (I),

wherein m is as defined for the general formula (I),

wherein m is as defined for the general formula (I).

3. A heat curable resin composition comprising the polyphenylene ether derivative (A) according to claim 1 and a thermosetting resin (B).

4. The heat curable resin composition according to claim 3 , wherein the polyphenylene ether derivative (A) has a number average molecular weight of 5,000 to 12,000.

5. The heat curable resin composition according to claim 3 , wherein the thermosetting resin (B) is at least one selected from the group consisting of an epoxy resin, a cyanate ester resin, and a maleimide compound.

6. The heat curable resin composition according to claim 5 , wherein the maleimide compound as the thermosetting resin (B) comprises a bismaleimide compound (a) having at least two N-substituted maleimide groups in a molecule, or a polyaminobismaleimide compound (c) represented by the following general formula (VI):

wherein A 4 is a residual group represented by one of the following general formulas (VII), (VIII), (IX), or (X), and A 5 is a residual group represented by the following general formula (XI):

wherein R 10 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom,

wherein R 11 and R 12 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A 6 represents an alkylene group or alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a ketone group, a single bond, or a residual group represented by the following general formula (VIII-1):

wherein R 13 and R 14 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A 7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a ketone group, or a single bond,

wherein i is an integer of 1 to 10,

wherein R 15 and R 16 each independently represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and j is an integer of 1 to 8,

wherein R 17 and R 18 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group, or a halogen atom, and As represents an alkylene group or alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a ketone group, a fluorenylene group, a single bond, or a residual group represented by one of the following general formulas (XI-1) or (XI-2):

wherein R 19 and R 20 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A 9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, a m- or p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a ketone group, or a single bond,

wherein R 21 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A 10 and A 11 each represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a ketone group, or a single bond.

7. The heat curable resin composition according to claim 3 , wherein the ratio of the polyphenylene ether derivative (A) and thermosetting resin (B) contained is in the range of: (A):(B) =(5 to 80% by mass

Assignees

• Hitachi Chemical Co Ltd
• Hitachi Chemical Co Ltd

Inventors

• Mizuno Yasuyuki
• Fukuda Tomio
• Tanigawa Takao
• Nagai Yuki
• Murai Hikari

Classifications

• C08J2371/12

  Polyphenylene oxides · CPC title

• C08G65/485 Primary

  Polyphenylene oxides · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08G65/48 Primary

  Polymers modified by chemical after-treatment · CPC title

• C09D171/12

  Polyphenylene oxides · CPC title