Resin composition, prepreg, laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9902851-B2
Application number	US-201314435585-A
Country	US
Kind code	B2
Filing date	Oct 18, 2013
Priority date	Oct 19, 2012
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D):

wherein R a each independently represent an organic group having an epoxy group; R b each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

First claim

What is claimed is:

1. A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D):

wherein R a each independently represent an organic group having an epoxy group; R b each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of from 0 to 2; and y represents an integer of from 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

2. The resin composition according to claim 1 , wherein the epoxy group of the cyclic epoxy-modified silicone compound (A) represented by formula (1) is a 3,4-epoxycyclohexylethyl group.

3. The resin composition according to claim 1 , wherein a ratio of a cyanate group equivalent of the cyanic acid ester compound (B) and/or a hydroxyl group equivalent of the phenol resin (C) to an epoxy group equivalent of an epoxy compound contained in the resin composition is from 0.3 to 0.7, wherein the cyanate group equivalent of the cyanic acid ester compound (B) and/or the hydroxyl group equivalent of the phenol resin (C) is set as a numerator and the epoxy group equivalent of an epoxy compound contained in the resin composition is set as a denominator.

4. The resin composition according to claim 1 , further containing a non-halogen epoxy resin (E).

5. The resin composition according to claim 1 , further containing a maleimide compound (F).

6. The resin composition according to claim 1 , wherein the cyanic acid ester compound (B) is a naphtholaralkyl-based cyanic acid ester compound represented by formula (5) and/or a novolac-based cyanic acid ester compound represented by formula (6):

wherein R 1 each independently represent a hydrogen atom or a methyl group and n1 represents an integer of 1 or more,

wherein R 2 each independently represent a hydrogen atom or a methyl group and n2 represents an integer of 1 or more.

7. The resin composition according to claim 1 , wherein the phenol resin (C) is a naphtholaralkyl-based phenol resin represented by formula (7) and/or a biphenylaralkyl-based phenol resin represented by formula (8):

wherein R 3 each independently represent a hydrogen atom or a methyl group and n3 represents an integer of 1 or more,

wherein R 4 represents a hydrogen atom or a methyl group and n4 represents an integer of 1 or more.

8. The resin composition according to claim 5 , wherein the maleimide compound (F) is a compound represented by formula (15):

wherein R 10 each independently represent a hydrogen atom or a methyl group and n10 represents an integer of 1 or more.

9. The resin composition according to claim 5 , wherein the content of the cyclic epoxy-modified silicone compound (A) based on 100 parts by mass of the total amount of the cyclic epoxy-modified silicone compound (A), the cyanic acid ester compound (B), the phenol resin (C), the non-halogen epoxy resin (E), and the maleimide compound (F) is from 5 to 50 parts by mass.

10. The resin composition according to claim 5 , wherein the total content of the cyanic acid ester compound (B) and the phenol resin (C) based on 100 parts by mass of the total amount of the cyclic epoxy-modified silicone compound (A), the cyanic acid ester compound (B), the phenol resin (C), the non-halogen epoxy resin (E), and the maleimide compound (F) is from 10 to 50 parts by mass.

11. The resin composition according to claim 5 , wherein the content of the inorganic filler (D) based on 100 parts by mass of the total amount of the cyclic epoxy-modified silicone compound (A), the cyanic acid ester compound (B), the phenol resin (C), the non-halogen epoxy resin (E) and the maleimide compound (F) is from 50 to 500 parts by mass.

12. The resin composition according to claim 5 , wherein the content of the maleimide compound (F) based on 100 parts by mass of the total amount of the cyclic epoxy-modified silicone compound (A), the cyanic acid ester compound (B), the phenol resin (C), the non-halogen epoxy resin (E) and the maleimide compound (F) is from 5 to 50 parts by mass.

13. A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a BT resin (G) obtained by pre-polymerizing a cyanic acid ester compound and a maleimide compound, and an inorganic filler (D):

wherein R a each independently represent an organic group having an epoxy group; R b each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of from 0 to 2; and y represents an integer of from 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

14. The resin composition according to claim 13 , wherein a ratio of a cyanate group equivalent of the cyanic acid ester compound used in the BT resin (G) to an epoxy group equivalent of an epoxy compound contained in the resin composition is from 0.3 to 0.7, wherein the cyanate group equivalent is set as a numerator and the epoxy group equivalent is set as a denominator.

15. The resin composition according to claim 13 , further containing a non-halogen epoxy resin (E).

16. The resin composition according to claim 13 , wherein the cyanic acid ester compound (B) used in the BT resin (G) is a naphtholaralkyl-based cyanic acid ester compound represented by formula (5) and/or a novolac-based cyanic acid ester compound represented by formula (6):

wherein R 1 each independently represent a hydrogen atom or a methyl group and n1 represents an integer of 1 or more,

wherein R 2 each independently represent a hydrogen atom or a methyl group and n2 represents an integer of 1 or more.

17. The resin composition according to claim 13 , wherein the maleimide compound used in the BT resin (G) is a compound represented by formula (15):

wherein R 10 each independently represent a hydrogen atom or a methyl group and n10 represents an integer of 1 or more.

18. The resin composition according to claim 15 , wherein the content of the cyclic epoxy-modified silicone compound (A) based on 100 parts by mass of the total amount of the cyclic epoxy-modified silicone compound (A), the BT resin (G) and the non-halogen epoxy resin (E) is from 5 to 50 parts by mass.

19. The resin composition according to claim 15 , wherein the content of the BT resin (G) based on 100 parts by mass of the total amount of the cyclic epoxy-modifi

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Takahashi Hiroshi
• Chiba Tomo
• Ohnishi Nobuyoshi
• Tomizawa Katsuya
• Takada Keisuke
• Shiga Eisuke
• Ogashiwa Takaaki

Classifications

• B32B5/024

  Woven fabric · CPC title

• B32B2260/021

  Fibrous or filamentary layer · CPC title

• B32B2262/101

  Glass fibres · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08L71/126

  modified by chemical after-treatment · CPC title