Halogen-free resin composition and uses thereof

Patent metadata

Field	Value
Publication number	US-9840620-B2
Application number	US-201415022154-A
Country	US
Kind code	B2
Filing date	Mar 21, 2014
Priority date	Feb 14, 2014
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

First claim

The invention claimed is:

1. A halogen-free resin composition comprising the following:
(A) 40-80 parts by weight of allyl modified benzoxazine resin;
(B) 10-20 parts by weight of hydrocarbon resin;
(C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; and
(D) 0.01-3 parts by weight of initiating agent.

2. The halogen-free resin composition according to claim 1 , wherein the allyl modified benzoxazine resin is selected from the group consisting of allyl modified bisphenol-A benzoxazine resin, allyl modified bisphenol-F benzoxazine resin, allyl modified dicyclopentadiene phenol benzoxazine resin, or allyl modified bisphenol-S benzoxazine resin, or a mixture of at least two of them.

3. The halogen-free resin composition according to claim 1 , wherein the hydrocarbon resin is a hydrocarbon resin which consists of carbon and hydrogen and has a number average molecular weight less than 11000 and a vinyl content greater than 60% and is liquid at room temperature.

4. The halogen-free resin composition according to claim 1 , wherein the hydrocarbon resin is a hydrocarbon resin which has a number average molecular weight less than 7000 and a content of vinyl added at 1,2 position carbon greater than 70% and is liquid at room temperature.

5. The halogen-free resin composition according to claim 1 wherein the allyl modified polyphenylene oxide resin is an allyl modified polyphenylene oxide resin having a number average molecular weight less than 5000.

6. The halogen-free resin composition according to claim 1 , wherein the initiating agent is selected from organic peroxide.

7. The halogen-free resin composition according to claim 1 , wherein the initiating agent is any one of dicumyl peroxide, tert-butyl peroxybenzoate or 2,5-bis(2-ethylhexanoylperoxy)-2,5-dimethylhexane, or a mixture of at least two of them.

8. The halogen-free resin composition according to claim 1 , wherein the halogen-free resin composition also comprises (E) filler.

9. The halogen-free resin composition according to claim 8 , wherein the content of the filler is 1-100 parts by weight.

10. The halogen-free resin composition according to claim 8 , wherein the filler is selected from any one of silicon dioxide, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminum nitride, silicon carbide or alumina, or a mixture of at least two of them.

11. The halogen-free resin composition according to claim 8 , wherein the filler is selected from any one of crystalline silicon dioxide, amorphous silicon dioxide, spherical silicon dioxide, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminum nitride, silicon carbide or alumina, or a mixture of at least two of them.

12. The halogen-free resin composition according to claim 8 , wherein the filler is silicon dioxide.

13. The halogen-free resin composition according to claim 8 , wherein the median of the particle diameter of the filler is 1-15μm.

14. The halogen-free resin composition according to claim 1 , wherein the halogen-free resin composition also comprises (F) phosphoric flame retardant.

15. The halogen-free resin composition according to claim 14 , wherein the content of the phosphoric flame retardant is 0-80 parts by weight, not including 0.

16. The halogen-free resin composition according to claim 14 , wherein the phosphoric flame retardant is any one of tri(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 2,6-bis(2,6-dimethylphenyl)phosphinobenzene, 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, or polyphenoxyphosphazene and derivatives thereof, or a mixture of at least two of them.

17. The halogen-free resin composition according to claim 1 , wherein the halogen content of the halogen free resin composition is less than 0.09% by weight.

18. A resin varnish, wherein the resin varnish is obtained by dissolving or dispersing the halogen-free resin composition according to claim 1 in a solvent.

19. A prepreg, wherein the prepreg comprises a reinforcing material and the halogen-free resin composition according to claim 1 which is attached on the reinforcing material after impregnation and drying.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Yang Hu
• He Yueshan

Classifications

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08J2371/12

  Polyphenylene oxides · CPC title

• C08G14/06

  and monomers containing hydrogen attached to nitrogen · CPC title

• B32B15/08 Primary

  of synthetic resin · CPC title

• C08L71/126

  modified by chemical after-treatment · CPC title