Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9708468-B2
Application number	US-201414775691-A
Country	US
Kind code	B2
Filing date	Oct 23, 2014
Priority date	Oct 31, 2013
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture.

First claim

The invention claimed is:

1. A thermosetting resin composition comprising:
a thermosetting resin;
a hardener capable of reacting with the thermosetting resin; and
a flame retardant containing a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture,
wherein the thermosetting resin contains a modified polyphenylene ether compound which has a structure in which a polyphenylene is terminal-modified by a substituent expressed by the following formula (4):

wherein R 8 in formula (4) is either a hydrogen atom or an alkyl group; and
the hardener contains a cross-linking hardener having carbon-carbon unsaturated double bonds in a molecule.

2. The thermosetting resin composition according to claim 1 ,
wherein a mass ratio of the first phosphor compound is 20% to 80%, inclusive, with respect to a total of the first and second phosphor compounds.

3. The thermosetting resin composition according to claim 1 , wherein a content of phosphorus atoms is in a range from 1.8 to 5.2 parts, inclusive, by mass with respect to 100 parts by mass of a total of the flame retardant and organic components other than the flame retardant.

4. The thermosetting resin composition according to claim 1 ,
wherein the first phosphor compound is at least one selected from the group consisting of phosphate compounds, phosphazene compounds, phosphite compounds, and phosphine compounds; and
the second phosphor compound is at least one selected from the group consisting of phosphinate compounds, polyphosphate compounds, and phosphonium salt compounds.

5. The thermosetting resin composition according to claim 1 , further comprising as a filler at least one selected from the group consisting of silicas, micas, and talcs.

6. The thermosetting resin composition according to claim 5 , wherein a content of the filler is in a range from 10 to 300 parts by mass, inclusive, with respect to 100 parts by mass of a total of the flame retardant and organic components other than the flame retardant.

7. The thermosetting resin composition according to claim 1 ,
wherein a weight-average molecular weight of the cross-linking hardener is 100 to 5000; and
an average number of the carbon-carbon unsaturated double bonds per molecule of the cross-linking hardener is in a range from 1 to 20, inclusive.

8. The thermosetting resin composition according to claim 1 ,
wherein the cross-linking hardener is at least one selected from the group consisting of trialkenyl isocyanurate compounds; polyfunctional acrylate compounds having at least two acrylic groups in a molecule; polyfunctional methacrylate compounds having at least two methacrylic groups in a molecule; and polyfunctional vinyl compounds having at least two vinyl groups in a molecule.

9. The thermosetting resin composition according to claim 1 ,
wherein a weight-average molecular weight of the modified polyphenylene ether compound is 500 to 5000; and
an average number of the substituents per molecule of the modified polyphenylene ether compound is in a range from 1 to 5, inclusive.

10. The thermosetting resin composition according to claim 1 ,
wherein the substituents at a terminal of the modified polyphenylene ether compound have at least one selected from the group consisting of a vinylbenzyl group, an acrylate group, and a methacrylate group.

11. The thermosetting resin composition according to claim 1 ,
wherein a mass ratio of the modified polyphenylene ether compound with respect to a total of the modified polyphenylene ether compound and the cross-linking hardener is in a range from 30% to 90%, inclusive.

12. A prepreg comprising:
a fibrous base member; and
the thermosetting resin composition according to claim 1 , impregnated into the fibrous base member.

13. A metal-clad laminate comprising:
an insulating layer as a hardened material of the prepreg according to claim 12 ; and
a metal foil laminated on the insulating layer.

14. A printed circuit board comprising:
an insulating layer as a hardened material of the prepreg according to claim 12 ; and
a conductor pattern formed on the insulating layer.

15. A thermosetting resin composition comprising:
a thermosetting resin;
a hardener capable of reacting with the thermosetting resin; and
a flame retardant containing a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture,
wherein
the thermosetting resin contains a polyphenylene ether compound having a weight-average molecular weight of 500 to 5000 and an epoxy compound having at least two epoxy groups in a molecule,
the hardener contains a cyanate ester compound,
a mass ratio of the first phosphor compound is from 20% to 80%, inclusive, with respect to a total of the first and second phosphor compounds; and
a content of each of the polyphenylene ether compound, the epoxy compound, and the cyanate ester compound is in a range from 20 to 50 parts by mass, inclusive, with respect to 100 parts by mass of a total of the polyphenylene ether compound, the epoxy compound, and the cyanate ester compound.

16. The thermosetting resin composition according to claim 15 , wherein
the polyphenylene ether compound contains one or more phenolic hydroxyl groups at a terminal; and
an average number of the phenolic hydroxyl group per molecule of the polyphenylene ether compound is in a range from 1 to 5, inclusive.

17. The thermosetting resin composition according to claim 15 ,
wherein the polyphenylene ether compound contains a reaction product in which at least a part of the hydroxyl groups in the polyphenylene ether are pre-reacted with the epoxy groups of the epoxy compound.

18. The thermosetting resin composition according to claim 15 , further comprising a metal soap as a curing catalyst.

19. The thermosetting resin composition according to claim 15 ,
wherein the epoxy compound is at least one selected from the group consisting of bisphenol epoxy compounds, phenol novolak epoxy compounds, dicyclopentadiene epoxy compounds, cresol novolak epoxy compounds, bisphenol A novolak epoxy compounds, and naphthalene ring-containing epoxy compounds.

20. The thermosetting resin composition according to claim 15 ,
wherein a content of phosphorus atoms is in a range from 1.8 to 5.2 parts, inclusive, by mass with respect to 100 parts by mass of a total of the flame retardant and organic components other than the flame retardant.

21. The thermosetting resin composition according to claim 15 ,
wherein the first phosphor compound is at least one selected from the group consisting of phosphate compounds, phosphazene compounds, phosphite compounds, and phosphine compounds; and
the second phosphor compound is at least one selected from the group consisting of phosphinate compounds, polyphosphate compounds, and phosphonium salt compounds.

22. The thermosetting resin composition according to claim 15 , further comprising as a filler at least one selected from the group consisting of silicas, micas, and talcs.

23. The thermosetting resin composition according to claim 22 ,
wherein a content of the filler is in a range from 10 to 300 parts by mass, inclusive, with respect to 100 parts by mass of a total of the flame re

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Kitai Yuki
• Fujiwara Hiroaki
• Saito Hirosuke

Classifications

• C08L101/00

  Compositions of unspecified macromolecular compounds · CPC title

• B32B2260/021

  Fibrous or filamentary layer · CPC title

• C08G59/4014

  Nitrogen containing compounds · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• C08K5/521 Primary

  Esters of phosphoric acids, e.g. of H3PO4 · CPC title