Resin composition, prepreg and metal-foil-clad laminate

Patent metadata

Field	Value
Publication number	US-9743515-B2
Application number	US-38519409-A
Country	US
Kind code	B2
Filing date	Apr 1, 2009
Priority date	Apr 1, 2008
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e). The resin composition is for use in a printed wiring board for high multilayer and high frequency, and is excellent in moldability, electric characteristics, peel strength, flame resistance and heat resistance after moisture absorption. Further, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.

First claim

What is claimed is:

1. A resin composition comprising:
a vinyl compound (a) represented by the formula (1) in an amount of 50 to 80 parts by weight based on 100 parts by weight of a resin solid content in the resin composition,
a naphthol aralkyl cyanate ester resin (b) represented by the formula (5) in an amount of 3 to 10 parts by weight based on 100 parts by weight of a resin solid content in the resin composition,
a bisphenol A cyanate ester resin (c) in an amount of 3 to 10 parts by weight based on 100 parts by weight of a resin solid content in the resin composition,
a brominated flame retardant (d) comprising a brominated polycarbonate resin oligomer, a brominated novolak epoxy resin and a brominated bisphenol A epoxy resin in a total amount of 5 to 35 parts by weight based on 100 parts by weight of a resin solid content in the resin composition, and
an inorganic filler (e) in an amount of 10 to 150 parts by weight based on 100 parts by weight of a resin solid content in the resin composition,

wherein —(O—X—O)— represents a structural unit of the formula (2) or (3), —(Y—O)— is an arrangement of a structural unit of the formula (4) or a random arrangement of at least two kinds of structural units of the formula (4), and each of p and q is an integer of 0 to 100, provided that at least one of p and q is not 0,

wherein R 1 , R 2 , R 3 , R 7 and R 8 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R 4 , R 5 and R 6 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group,

wherein R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group and -A- represents a linear, branched or cyclic bivalent hydrocarbon group having 20 or less carbon atoms,

wherein R 17 and R 18 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R 19 and R 20 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group,

wherein R represents a hydrogen atom or a methyl group and n is 1 to 10 as an average value, and

wherein the resin composition exhibits superior results when compared to an identical resin composition that does not contain the naphthol aralkyl cyanate ester resin (b) represented by formula (5) or the bisphenol A cyanate ester resin (c).

2. The resin composition according to claim 1 ,
wherein, in the vinyl compound (a), —(O—X—O)— is a structural unit of the formula (6), the formula (7) or the formula (8), and —(Y—O)— is an arrangement of a structural unit of the formula (9) or the formula (10) or a random arrangement of structural units of the formula (9) and the formula (10),

wherein R 11 , R 12 , R 13 and R 14 are the same or different and represent a hydrogen atom or a methyl group and -A- represents a linear, branched or cyclic bivalent hydrocarbon group having 20 or less carbon atoms,

wherein -A- represents a linear, branched or cyclic bivalent hydrocarbon group having 20 or less carbon atoms,

3. A prepreg comprising the resin composition as defined in claim 1 and a glass woven fabric (f).

4. A metal-foil-clad laminate obtained by placing one prepreg as defined in claim 3 or stacking at least two prepregs as defined in claim 3 , disposing a metal foil on one side or both sides of the prepreg or the stacked prepregs and laminate-molding the metal foil and the prepreg or the stacked prepregs.

5. A resin sheet obtained by applying a solution of the resin composition as defined in claim 1 to a surface of a metal foil or a film and drying the applied solution.

6. The resin composition according to claim 1 , further comprising a cross-linking curing agent selected from the group consisting of triallyl isocyanurate and triallyl cyanurate.

7. A printed wiring board having an insulation layer comprising the resin composition according to claim 1 .

Assignees

• Mori Kenichi
• Ito Shoichi
• Mitsubishi Gas Chemical Co

Inventors

• Mori Kenichi
• Ito Shoichi

Classifications

• Y10T428/31678

  Of metal · CPC title

• H05K1/0373 Primary

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• Y10T442/30

  Woven fabric [i.e., woven strand or strip material] · CPC title

• C08L71/126

  modified by chemical after-treatment · CPC title

• C08K3/36

  Silica · CPC title