Halogen-free resin composition and use thereof

Patent metadata

Field	Value
Publication number	US-9771479-B2
Application number	US-201415027353-A
Country	US
Kind code	B2
Filing date	Mar 21, 2014
Priority date	Feb 14, 2014
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

First claim

The invention claimed is:

1. A halogen-free resin composition based on the weight parts of organic solids, comprising:
(A) from about 40 to about 80 parts by weight of allyl-modified benzoxazine resin,
(B) from about 10 to about 20 parts by weight of hydrocarbon resin,
(C) from about 10 to about 40 parts by weight of allyl-modified polyphenyl ether resin,
(D) from about 10 to about 20 parts by weight of allyl-modified bismaleimide resin, and
(E) from about 0.01 to about 3 parts by weight of an initiator.

2. The halogen-free resin composition according to claim 1 , wherein the allyl-modified benzoxazine resin is one or a mixture of at least two selected from allyl-modified bisphenol-A benzoxazine resin, allyl-modified bisphenol-F benzoxazine resin, allyl-modified dicyclopentadiene phenol benzoxazine resin, allyl-modified bisphenol-S benzoxazine resin, and diamine benzoxazine resin.

3. The halogen-free resin composition according to claim 1 , wherein the allyl-modified polyphenyl ether resin has an average molecular weight of less than about 5000.

4. The halogen-free resin composition according to claim 1 , wherein the halogen-free resin composition further comprises (F) a filler.

5. The halogen-free resin composition according to claim 1 , wherein the halogen-free resin composition further comprises (G) a phosphorus-containing flame retardant.

6. The halogen-free resin composition according to claim 1 , wherein the halogen-free resin composition has a halogen content of less than about 0.09 wt. %.

7. A resin varnish, wherein the resin varnish is obtained by dissolving or dispersing the halogen-free resin composition according to claim 1 in a solvent.

8. A prepreg comprising a reinforcing material and a halogen-free resin composition according to claim 1 attached thereon after impregnation and drying.

9. A laminate comprising at least one prepreg according to claim 8 .

10. A copper-clad laminate, comprising at least one superimposed prepreg according to claim 8 and copper foils coated on one or two sides of the superimposed prepreg.

11. The halogen-free resin composition according to claim 1 , wherein the hydrocarbon resin is composed of carbon and hydrogen, has an average molecular weight of less than about 11000, an ethylene content of higher than about 60% and is a liquid at room temperature.

12. The halogen-free resin composition according to claim 1 , wherein the hydrocarbon has a number average molecular weight of less than about 7000, an ethylene content added at positions 1, 2 of higher than about 70%, and is a liquid at room temperature.

13. The halogen-free resin composition according to claim 1 , wherein the initiator is selected from the group consisting of one or more organic peroxides.

14. The halogen-free resin composition according to claim 1 , wherein the initiator is one or a mixture of at least two selected from dicumyl peroxide, tert-butyl peroxybenzoate and 2,5-di(2-ethyl hexanoyl peroxy)-2,5-dimethylhexane.

15. The halogen-free resin composition according to claim 4 , wherein the filler is in an amount of from about 1 to about 100 parts by weight.

16. The halogen-free resin composition according to claim 15 , characterized in that the filler is in an amount of from about 10 to about 100 parts by weight.

17. The halogen-free resin composition according to claim 8 , wherein the filler is one or a mixture of at least two selected from silica, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminum nitride, silicon carbide and alumina.

18. The halogen-free resin composition according to claim 17 , wherein the filler is one, or a mixture of at least two, selected from crystalline silica, amorphous silica, spherical silica, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminum nitride, silicon carbide and alumina.

19. The halogen-free resin composition according to claim 4 , wherein the filler is silica.

20. The halogen-free resin composition according to claim 4 , wherein the moderate value of the particle size of the filler is from about 1 μm to about 15 μm.

21. The halogen-free resin composition according to claim 5 , wherein the phosphorus-containing flame retardant is in an amount of from about 0 to about 80 parts by weight, excluding 0 parts by weight.

22. The halogen-free resin composition according to claim 5 , wherein the phosphorus-containing flame retardant is one or a mixture of at least two selected from tri-(2,6-dimethylphenyl)-phosphine, 10-(2,5-dihydroxylphenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 2,6-di-(2,6-dimethylphenyl)phosphine benzene, 10-phenyl-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, polyphenoxyphosphazene and derivatives thereof.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Yang Hu
• He Yueshan

Classifications

• C08L25/10

  with conjugated dienes · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• C08K3/36

  Silica · CPC title

• C08K5/14

  Peroxides · CPC title

• H05K2201/0355

  Metal foils · CPC title