Inkjet printhead with encapsulant-retaining features
US-10864733-B2 · Dec 15, 2020 · US
Ink-jet print cartridges
Ink-jet print cartridges · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81B2201/052 |
| Official title | Ink-jet print cartridges |
| Display label | Ink-jet print cartridges |
| Total patents | 85 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 8 |
| 2017 | 12 |
| 2018 | 15 |
| 2019 | 16 |
| 2020 | 8 |
| 2021 | 2 |
| 2022 | 6 |
| 2023 | 8 |
| 2024 | 2 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Inkjet printhead with grout retaining features
US-10850517-B2 · Dec 1, 2020 · US
Process for forming inkjet nozzle devices
US-10822228-B2 · Nov 3, 2020 · US
Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head
US-10661566-B2 · May 26, 2020 · US
Anti-wetting coating for Si-based MEMS fluidic device, and method of application of same
US-10626013-B2 · Apr 21, 2020 · US
Process for filling etched holes using first and second polymers
US-10597290-B2 · Mar 24, 2020 · US
Nozzle substrate, ink-jet print head, and method for producing nozzle substrate
US-10500857-B2 · Dec 10, 2019 · US
Inkjet printhead with grout retaining features
US-2019337292-A1 · Nov 7, 2019 · US
Inkjet printhead with encapsulant-retaining features
US-2019337291-A1 · Nov 7, 2019 · US
Method for processing silicon substrate and method for manufacturing liquid ejection head
US-10464325-B2 · Nov 5, 2019 · US
Anti-Wetting Coating for Si-Based MEMS Fluidic Device, and Method of Application of Same
US-2019308875-A1 · Oct 10, 2019 · US
Process for filling etched holes using first and second polymers
US-2019263657-A1 · Aug 29, 2019 · US
Method of forming space for use in analysis devices
US-10364142-B2 · Jul 30, 2019 · US
Bond rings in semiconductor devices and methods of forming same
US-10351418-B2 · Jul 16, 2019 · US
Method for forming film and method for manufacturing inkjet print head
US-10343403-B2 · Jul 9, 2019 · US
Process for filling etched holes using photoimageable thermoplastic polymer
US-10329146-B2 · Jun 25, 2019 · US
Mems device, liquid ejecting head, and liquid ejecting apparatus
US-2019143690-A1 · May 16, 2019 · US
Amorphous thin metal film
US-2019119101-A1 · Apr 25, 2019 · US
MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device
US-10246321-B2 · Apr 2, 2019 · US
MEMS device, head and liquid jet device
US-10220619-B2 · Mar 5, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81B2201/052?
- CPC B81B2201/052 is the Cooperative Patent Classification code for “Ink-jet print cartridges.”
- How many patents are filed under CPC B81B2201/052 (Ink-jet print cartridges)?
- Our database includes 85 publications tagged with this CPC code.
- Is patent activity under CPC B81B2201/052 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).