MEMS device, head and liquid jet device

Patent metadata

Field	Value
Publication number	US-10220619-B2
Application number	US-201615547000-A
Country	US
Kind code	B2
Filing date	Mar 3, 2016
Priority date	Mar 4, 2015
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrate 30 provided with a bump 32 including a primary electrode 34, and a secondary substrate 10 provided with a secondary electrode 91 on a bottom surface of a recessed portion 36 formed by an adhesive layer 35. The primary substrate 10 and the secondary substrate 30 are joined together with the adhesive layer 35, the primary electrode 34 is electrically connected to the secondary electrode 91 with the bump 32 inserted into the recessed portion 36, and part of the bump 32 and the adhesive layer 35 forming the recessed portion 36 overlap each other in a direction in which the bump 32 is inserted into the recessed portion 36.

First claim

The invention claimed is:

1. An MEMS device comprising:
a primary substrate provided with a bump including a primary electrode; and
a secondary substrate provided with a secondary electrode on a bottom surface of a recessed portion formed by an adhesive layer,
wherein the primary substrate and the secondary substrate are joined together with the adhesive layer,
wherein the primary electrode is electrically connected to the secondary electrode with the bump inserted into the recessed portion,
wherein part of the bump and the adhesive layer forming the recessed portion overlap each other in a direction in which the bump is inserted into the recessed portion, and
wherein a gap is provided between the adhesive layer and the bump so as to keep the adhesive layer out of contact with the bump, and
wherein one or more surfaces of the adhesive layer forming the recessed portion are inclined toward the secondary substrate side so as to form the gap.

2. The MEMS device according to claim 1 , wherein the bump includes an elastic core portion, and a metal film provided on a surface of the core portion.

3. The MEMS device according to claim 2 , wherein
the primary substrate is provided with a plurality of the primary electrodes,
the core portion of the bump is provided independently for each of the primary electrodes, and
the adhesive layer is provided between each pair of the core portions adjacent to each other.

4. A head comprising:
the MEMS device according to claim 1 ;
a pressure generating chamber formed in the secondary substrate and communicating with a nozzle; and
a piezoelectric element attached to a primary substrate side of the secondary substrate, the piezoelectric element connected to the secondary electrode and configured to cause a pressure change in a liquid in the pressure generating chamber.

5. A liquid jet device comprising the head according to claim 4 .

6. The MEMS device according to claim 1 , wherein the adhesive layer is made of a photosensitive resin.

Assignees

• Seiko Epson Corp

Inventors

• Tanaka Shuichi

Classifications

• B81B2201/052

  Ink-jet print cartridges · CPC title

• B41J2/1623 Primary

  bonding and adhesion · CPC title

• B41J2002/14419

  Manifold · CPC title

• B41J2/1631

  photolithography · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title