Electronic device
US-2016276571-A1 · Sep 22, 2016 · US
MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device
US10246321B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10246321-B2 |
| Application number | US-201715698459-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 7, 2017 |
| Priority date | Sep 30, 2016 |
| Publication date | Apr 2, 2019 |
| Grant date | Apr 2, 2019 |
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- Title
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- Abstract
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- Assignees and inventors
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Abstract
Official abstract text for this publication.
There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction.
First claim
Opening claim text (preview).
What is claimed is: 1. A MEMS device comprising: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin and a first wiring that covers at least a portion of a surface of the resin portion, wherein the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and wherein a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction, wherein the resin portion includes a first portion and a second portion that is adjacent to the first portion along the second direction and of which a height from the one surface is lower than that of the first portion, wherein the first wiring is provided at a position overlapping the first portion, wherein a width of the first portion is equal to or larger than the width of the first wiring covering the first portion in the second direction, wherein a second wiring is between the first portion and the first wiring, wherein a width of the second wiring is equal or larger than the width of the first wiring covering the first portion in the second direction, and wherein the width of the second wiring is larger than the width of the first portion in the second direction. 2. A liquid ejecting head which includes a nozzle for ejecting a liquid, comprising: a structure of the MEMS device according to claim 1 . 3. A liquid ejecting apparatus comprising: the liquid ejecting head according to claim 2 .
Assignees
Inventors
Classifications
- B41J2/14233Primary
of film type, deformed by bending and disposed on a diaphragm · CPC title
Interconnects · CPC title
of film type, deformed by bending and disposed on a diaphragm · CPC title
photolithography · CPC title
Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias · CPC title
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Frequently asked questions
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- What does patent US10246321B2 cover?
- There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the …
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification B41J2/14233. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).