Method for forming film and method for manufacturing inkjet print head

Patent metadata

Field	Value
Publication number	US-10343403-B2
Application number	US-201715817963-A
Country	US
Kind code	B2
Filing date	Nov 20, 2017
Priority date	Nov 25, 2016
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.

First claim

What is claimed is:

1. A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method comprising, in order, the steps of:
providing a substrate having a through hole that passes therethrough from a first surface to a second surface, the second surface being a surface opposite to the first surface;
forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface;
recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening; and
forming a film that covers the side wall of the through hole.

2. The method for forming a film according to claim 1 , wherein the lid member is removed from the substrate after the film that covers the side wall of the through hole is formed.

3. The method for forming a film according to claim 2 , wherein a space is located inside the lid member in the recessing, in a direction away from the first surface, of a surface of the lid member that blocks the opening.

4. The method for forming a film according to claim 2 , wherein a through hole is formed in the lid member in the recessing, in a direction away from the first surface, of a surface of the lid member that blocks the opening.

5. The method for forming a film according to claim 2 , wherein the lid member is a dry film.

6. The method for forming a film according to claim 2 , wherein the lid member is a tape bonding layer.

7. The method for forming a film according to claim 1 , wherein the lid member is a dry film.

8. The method for forming a film according to claim 1 , wherein a through hole is formed in the lid member in the recessing, in a direction away from the first surface, of a surface of the lid member that blocks the opening.

9. The method for forming a film according to claim 2 , wherein the lid member contains a photosensitive resin.

10. The method for forming a film according to claim 2 , wherein the film is formed by any one of an ALD method, a CVD method, a sputtering method, and an evaporation method.

11. The method for forming a film according to claim 1 , wherein the lid member contains a photosensitive resin.

12. The method for forming a film according to claim 1 , wherein the lid member is a tape bonding layer.

13. The method for forming a film according to claim 1 , wherein the film is formed by any one of an ALD method, a CVD method, a sputtering method, and an evaporation method.

14. The method for forming a film according to claim 1 , wherein a space is located inside the lid member in the recessing, in a direction away from the first surface, of a surface of the lid member that blocks the opening.

15. The method for forming a film according to claim 1 , wherein the film is at least one of a silicon oxide film, a silicon nitride film, a silicon carbide film, tantalum, gold, and nickel.

16. The method for forming a film according to claim 1 , wherein the lid member does not extend into the through hole in the substrate when the substrate is viewed from below in the vertical direction after the recessing, in a direction away from the first surface, of a surface of the lid member that blocks the opening.

17. The method for forming a film according to claim 1 , wherein a space or a through hole with a side wall having a forward-tapered shape is formed in the lid member by the recessing, in a direction away from the first surface, of a surface of the lid member that blocks the opening.

18. The method for forming a film according to claim 1 , wherein the lid member is composed of at least 2 layers.

19. A method for manufacturing an inkjet print head including a supply hole provided with a protective film that protects the supply hole of the inkjet print head, the method comprising, in order, the steps of:
providing a substrate having a supply hole that passes therethrough from a first surface to a second surface, the second surface being a surface opposite to the first surface;
forming, on the first surface, a lid member that blocks an opening of the supply hole open on the first surface;
recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening; and
forming a film that covers the side wall of the supply hole.

20. The method for manufacturing an inkjet print head according to claim 19 , wherein the lid member is a passage-forming member that forms an ink passage.

Assignees

• Canon Kk

Inventors

• Teranishi Atsushi
• Uyama Masaya

Classifications

• B41J2/1628 Primary

  dry etching · CPC title

• B81B2203/0353

  Holes · CPC title

• B41J2/1642

  thin film formation by CVD [chemical vapor deposition] · CPC title

• B81C1/00087

  Holes · CPC title

• B81C2201/019

  Bonding or gluing multiple substrate layers · CPC title