Method for manufacturing terminal-strip-equipped electronic component and terminal-strip-equipped electronic component
US-9527150-B2 · Dec 27, 2016 · US
for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence)
for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/0638 |
| Official title | {for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence)} |
| Display label | for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) |
| Total patents | 271 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 34 |
| 2016 | 32 |
| 2017 | 25 |
| 2018 | 26 |
| 2019 | 24 |
| 2020 | 27 |
| 2021 | 30 |
| 2022 | 16 |
| 2023 | 29 |
| 2024 | 12 |
| 2025 | 11 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder supply device
US-2016368072-A1 · Dec 22, 2016 · US
Solder bump forming method and apparatus
US-9511438-B2 · Dec 6, 2016 · US
Stencil set and system for printing solder paste for printed circuit boards
US-2016345443-A1 · Nov 24, 2016 · US
Solder supply device
US-2016338209-A1 · Nov 17, 2016 · US
Solder supply device
US-2016303675-A1 · Oct 20, 2016 · US
Solder supply device
US-2016297021-A1 · Oct 13, 2016 · US
Bonding apparatus
US-2016284662-A1 · Sep 29, 2016 · US
Flux Recovery Device and Soldering Device
US-2016279726-A1 · Sep 29, 2016 · US
Flux Recovery Device and Soldering Device
US-2016250705-A1 · Sep 1, 2016 · US
Patterning method for component boards
US-9426901-B2 · Aug 23, 2016 · US
Component mounting line and component mounting method
US-9420702-B2 · Aug 16, 2016 · US
Screen printer, component mounting line, and screen printing method
US-9409248-B2 · Aug 9, 2016 · US
Screen printing machine and electronic component mounting system
US-9352409-B2 · May 31, 2016 · US
Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles
US-2016148840-A1 · May 26, 2016 · US
Electronic component mounting system
US-9332681-B2 · May 3, 2016 · US
C4NP compliant solder fill head seals
US-9314864-B2 · Apr 19, 2016 · US
Jetting discrete volumes of high viscosity liquid
US-9314812-B2 · Apr 19, 2016 · US
Filling method of conductive paste and manufacturing method of multi-layer printed circuit board
US-2016095227-A1 · Mar 31, 2016 · US
Double solder bumps on substrates for low temperature flip chip bonding
US-9295166-B2 · Mar 22, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K3/0638?
- CPC B23K3/0638 is the Cooperative Patent Classification code for “for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence).”
- How many patents are filed under CPC B23K3/0638 (for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence))?
- Our database includes 271 publications tagged with this CPC code.
- Is patent activity under CPC B23K3/0638 growing?
- Publication counts under this code: 12 in 2024 vs 11 in 2025 (latest complete years).