Patterning method for component boards

Patent metadata

Field	Value
Publication number	US-9426901-B2
Application number	US-201213650988-A
Country	US
Kind code	B2
Filing date	Oct 12, 2012
Priority date	Oct 12, 2011
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

First claim

What is claimed is:

1. A method of printing solder paste in a component board, the method comprising:
using a first stencil having a first thickness to pattern solder paste into at least one through hole in the component board, the first stencil defining at least one first aperture; and
using a second stencil subsequent to using said first stencil to print solder paste for at least one surface mounted part on the component board, said second stencil separate from the first stencil and having a second thickness less than or equal to the first thickness, the second stencil defining at least one surface mount aperture and at least one second aperture, the at least one second aperture being concentric with the at least one through hole and having a diameter greater than a diameter of the at least one through hole;
wherein using the first stencil includes placing the first stencil on a surface of the component board and printing solder paste through the at least one first aperture, and wherein using the second stencil includes placing the second stencil on the surface of the component board and printing solder paste through the at least one surface mount aperture and through the at least one second aperture.

2. The method of claim 1 , wherein each of said first and second thickness is less than 6 mils.

3. The method of claim 1 , wherein using said first stencil includes printing said solder paste into said at least one through hole multiple times until a volume of said solder paste fills said at least one through hole.

4. The method of claim 1 , wherein said first stencil and said second stencil are made of nickel or nickel alloy.

5. The method of claim 1 , wherein a diameter of said at least one aperture in said second stencil is slightly greater than a diameter of said at least one through hole.

6. The method of claim 1 , wherein said at least one first aperture is concentric with said at least one through hole.

7. The method of claim 1 , wherein using said second stencil includes printing said solder paste through said at least one aperture into said at least one through hole.

8. The method of claim 6 , wherein said at least one second aperture has a diameter greater than a diameter of said at least one first aperture, wherein the at least one surface mount aperture is located over a portion of copper pad for said at least one surface mounted part.

9. The method of claim 1 , wherein the second thickness is less than the first thickness.

10. The method of claim 1 , wherein the first thickness is between about 2 mils and about 8 mils, and the second thickness is between about 2 mils and about 5 mils.

Assignees

• Gen Electric
• Gen Electric

Inventors

• Trelford John Andrew
• Woods Jr William Lonzo
• Truong Thang Dahn

Classifications

• H05K1/112

  directly combined with via connections · CPC title

• H05K2201/0305

  Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns · CPC title

• H05K3/1216

  by screen printing or stencil printing · CPC title

• C23C18/06

  Coating on selected surface areas, e.g. using masks · CPC title

• H05K2203/1476

  Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning · CPC title