Solder supply device

Patent metadata

Field	Value
Publication number	US-2016303675-A1
Application number	US-201315100908-A
Country	US
Kind code	A1
Filing date	Dec 18, 2013
Priority date	Dec 18, 2013
Publication date	Oct 20, 2016
Grant date	—

Abstract

A solder supply device is provided with a solder cup housing liquid solder that is cylindrical and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; solder supplied from the tip of the nozzle section by the solder cup being moved; a magnet provided in the outer circumferential surface of the solder cup; and magnetic sensors able to detect the approaching of the magnet are provided at a position facing the outer circumferential surface of the solder container. Based on the positions of the magnet and the sensor, the post-movement position of the solder container is detected and it is detected that solder has run out from inside the solder cup.

First claim

1 . A solder supply device comprising:
a solder container housing liquid solder that is tubular and open at one end; a nozzle, for ejecting solder from the solder container, that is inserted into the solder container; and a piston that is fixedly provided on an outer circumferential section of the nozzle and that is engaged inside of the solder container from the opening of the solder container, wherein the solder supply device supplies solder from the tip of the nozzle by the solder container moving such that the piston advances inside the solder container, and wherein the solder supply device includes a magnet provided on an outer circumferential surface of the solder container, and a sensor provided at a position facing the outer circumferential surface of the solder container so as to detect the approaching of the magnet due to the movement of the solder container.

2 . The solder supply device according to claim 1 , wherein
the solder supply device is further provided with an outer tube that is tubular with an opening at one end and that stores the solder container in a state with the other end of the solder container engaged from the opening, and the solder container is moved by air being supplied to an air chamber that is demarcated by the other end of the solder container and the other end of the outer tube, so as to supply solder from the tip of the nozzle.

3 . The solder supply device according to claim 2 , wherein
the sensor is provided on an outer section of the outer tube and faces the outer circumferential surface of the solder container via the outer tube, and at least a portion of the outer tube that faces the sensor is formed from non-magnetic material.

4 . The solder supply device according to claim 1 , wherein
at least one of the magnet and the sensor are provided in a plural quantity lined up in a movement direction of the solder container.

5 . The solder supply device according to claim 1 , wherein
the solder container has a flange section formed on the outer circumferential section thereof, and the magnet is a ring-shaped member with an inside diameter that is smaller than the outer diameter of the flange section of the solder container, and larger than the outer diameter of the tubular portion of the solder container excluding the flange section.

Assignees

• Fuji Machine Mfg

Inventors

• Fujita Yoji

Classifications

• B23K3/0638 Primary

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• H05K3/3485

  Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12) · CPC title

• B05C11/1002

  Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves · CPC title

• B41F15/40

  Inking units · CPC title

• B05B12/124

  responsive to distance between spray apparatus and target · CPC title