Indirect printing bumping method for solder ball deposition
US-9216469-B2 · Dec 22, 2015 · US
US9409248B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9409248-B2 |
| Application number | US-201414548638-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 20, 2014 |
| Priority date | Nov 22, 2013 |
| Publication date | Aug 9, 2016 |
| Grant date | Aug 9, 2016 |
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Official abstract text for this publication.
A screen printer includes a mask, a substrate holding unit that clamps and holds a substrate below the mask by clamping members, a substrate holding unit moving mechanism that moves the substrate holding unit to contact the substrate with a lower surface of the mask, a paste filling unit that fills pattern holes of the mask with a paste, mask suction portions provided in the clamping members which suck the mask contacted with the substrate. The mask suction portions keep sucking the mask when the substrate holding unit moving mechanism moves the substrate in a direction away from the mask to perform plate releasing, and release the suction of the mask in a state in which the mask sucked to the mask suction portions maintains a posture parallel to the substrate after the movement of the substrate is started.
Opening claim text (preview).
What is claimed is: 1. A screen printer comprising: a mask that has pattern holes formed thereon; a substrate holding unit that clamps and holds a substrate at sides by a pair of clamping members below the mask; a substrate holding unit moving mechanism that moves the substrate holding unit holding the substrate to contact the substrate with a lower surface of the mask; a paste filling unit that fills, with a paste, the pattern holes of the mask contacted with the substrate by the substrate holding unit moving mechanism; mask suction portions that are provided in the pair of clamping members and that suck the mask being contacted with the substrate; and a control unit that controls the mask suction portions to keep sucking the mask when the substrate holding unit moving mechanism moves the substrate in a direction away from the mask to perform plate releasing after the pattern holes of the mask are filled with the paste, and to release the suction of the mask in a state in which the mask sucked to the mask suction portions maintains a posture parallel to the substrate after the movement of the substrate is started. 2. The screen printer according to claim 1 , wherein the mask suction portions suck the mask through vacuum suction or electromagnetic suction. 3. A component mounting line comprising: the screen printer according to claim 1 ; and a component mounting machine that mounts a component on the substrate on which the paste is printed by the screen printer. 4. A screen printing method comprising: a substrate holding step of clamping and holding a substrate at sides by a pair of clamping members below a mask having pattern holes formed thereon; a contact step of contacting the substrate clamped and held by the clamping members with a lower surface of the mask; a paste filling step of filling, with a paste, the pattern holes of the mask contacted with the substrate; and a plate releasing step of performing plate releasing by moving the substrate in a direction away from the mask after the pattern holes of the mask are filled with the paste, wherein in the plate releasing step, when the substrate is moved in the direction away from the mask, mask suction portions provided in the pair of clamping members keep sucking the mask, and, after the movement of the substrate is started, the suction of the mask to the mask suction portions is released in a state in which the mask sucked to the mask suction portions maintains a posture parallel to the substrate.
Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title
for articles with flat surfaces · CPC title
for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title
Stencil printing; Silk-screen printing · CPC title
for holding or positioning work · CPC title
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